Multichip MMIC package for X and K/sub a/ bands

Decker, D. L.; Olson, H.M.; Tatikola, R.; Gutierrez, R.; Mysoor, N. R.

doi:10.1109/96.554520

Cited by 6 publications

(2 citation statements)

References 7 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Over a period of half century, microwave circuits have experienced a transformation from low frequency to high frequency, from monolayer to multi-layered, giving rise to the appearance of MMCM [1]. However, as the system signal velocity getting higher and higher, the parasitic effect caused by interconnection and the package in the microwave multi-chip module is getting more and more serious, and it already became the bottleneck in restricting overall system performance [2] [3].…”

Section: Introductionmentioning

confidence: 99%

Vertical vias models for LTCC circuits based on BP neural networks

Zhang

Youqi

Wang

2011

2011 IEEE 3rd International Conference on Communication Software and Networks

View full text Add to dashboard Cite

The low temperature co-fired ceramics (LTCC) is an ideal packaging method that can be used to design highly reliable and miniature microwave multi-chip modules (MMCM). In this paper, modeling and simulation of the three dimensional vertical interconnection were carried out using three dimensional electromagnetic field analysis software HFSS. The BP neural network was used to forecast the parasitics of the vertical through hole. Good agreement was acquired between the simulated results and experimental results. The goal of this paper is to make the vertical vias as a circuit part, so as to enhance the efficiency of the design and processing of microwave circuits based on the LTCC. Simultaneously, it will also improve the design accuracy of the LTCC microwave circuits, providing the technical support for the design of more complex microwave circuits.

show abstract

Section: Introductionmentioning

confidence: 99%

Vertical vias models for LTCC circuits based on BP neural networks

Zhang

Youqi

Wang

2011

2011 IEEE 3rd International Conference on Communication Software and Networks

View full text Add to dashboard Cite

show abstract

“…They have investigated the effect of the cavity structure, multilayer ceramic structure and frame wall metallization on the performance of the MMICs being packaged and optimized the package for application in the 30-32 GHz frequency band. Decker et al [6] also have described development of a metal ceramic package for MCM application upto 35 GHz. In particular, optimization of the RF feedthrus to minimize insertion loss and VSWR for enhancing the performance of the package has been emphasized.…”

Section: Introductionmentioning

confidence: 99%

Electromagnetic Simulation and Characterization a Metal Ceramic Package for Packaging of High Isolation Switches

Chaturvedi¹,

Bhalke²,

Saravanan³

et al. 2010

PIER C

View full text Add to dashboard Cite

Abstract-Packaging of planar MMICs poses a unique challenge at microwave frequencies as the dimensions of the encapsulating cavity are comparable to wavelength at the operational frequencies. In addition, the effect of ground loops (caused by bond wires exposed to ground over extended length due to gaps between interconnects) deteriorates the situation even further in circuits like MMIC switches requiring high isolation between ports. The ground loops cause reflections thereby deteriorating the insertion loss figure of merit. This paper presents optimization of design of a metal ceramic package used for packaging an SPDT MMIC switch working in the frequency range of 5-6 GHz. The microwave performance of the package was simulated using EM simulation with parameters including cavity dimensions, port placement, gaps between interconnect lines, package feed-thrus and MMIC chip pads. Detailed characterization of the bare package and packaged SPDT MMIC done later shows a good match between the simulated and measured performance. The SPDT MMIC performance degradation was arrested by improvement in the package structure and it showed insertion loss of −1.6 dB and input/output (I/O) return losses of ∼ 16 dB in the new package as compared to the values of −2.1 dB insertion loss and −12 dB I/O return losses in the original package. The port-to-port isolation remained unchanged (∼ 40 dB in both cases) as it is governed by the MMIC assembly inside the package rather than the conditions at the I/O interfaces in this kind of large sized packages.

show abstract