Wideband characterization of multiple bondwires for millimeter-wave applications

Kim, Jin-Yang; Lee, Hai‐Young; Lee, Jae-Hyun; Chang, Dae-Ig

doi:10.1109/apmc.2000.926064

Cited by 8 publications

(4 citation statements)

References 8 publications

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“…The principle of waveguide probe can be referred to Song and colleagues. [1][2][3][4][5][6] Figure 2 shows the values of parameters of the proposed Flip-SMS transition. Generally, the liquid conductive adhesive will expand to some extent after sintering and solidification.…”

Section: Configuration Of the Proposed Packaging Methodsmentioning

confidence: 99%

“…The aim of this paper is to propose a MMIC packaging method, thus the design process of E‐plane probe is simply described. The principle of waveguide probe can be referred to Song and colleagues 1–6 . Figure 2 shows the values of parameters of the proposed Flip‐SMS transition.…”

Section: Configuration Of the Proposed Packaging Methodsmentioning

confidence: 99%

“…The research of waveguide probes and bonding wires have been extensively reported. [2][3][4][5][6][7][8] However, as operating frequencies increase, bonding wires will cause considerable loss due to the parasitic inductance. 9 Although this effect can be reduced by using multiple wires or shortening the wires, it is difficulty to apply them to sub-millimeter wave and terahertz devices due to the small circuit dimension.…”

Section: Introductionmentioning

confidence: 99%

“…At present, waveguides are widely used due to its low transmission loss, and a popular packaging technology to achieve MMIC‐to‐waveguide transition is based on waveguide probe and wire‐bonding technologies. The research of waveguide probes and bonding wires have been extensively reported 2–8 . However, as operating frequencies increase, bonding wires will cause considerable loss due to the parasitic inductance 9 .…”

Section: Introductionmentioning

confidence: 99%

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Broadband flip‐suspended‐microstrip transition for millimeter‐wave MMIC package

Zhang

Jiang

Zhang

et al. 2023

Micro & Optical Tech Letters

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In this letter, a novel millimeter-wave chip packaging method based on flip-suspended-microstrip technology is proposed. The flip-suspendedmicrostrip contains a waveguide probe, a suspended microstrip line, input and output matching lines, and a terminal pad. The waveguide probe realizes energy coupling from the rectangular waveguide, and the terminal pad above the signal pad of chip achieves power transmission via electronic contact. Thus, the bonding wires which will bring parasitic inductance at high frequencies are avoided. To validate the proposed packaging method, back-toback modules with coplanar waveguide/low noise amplifier were fabricated.The measured insertion loss of the back-to-back transition with a 1.75-mmlong coplanar waveguide is 2.6-4.2 dB over the entire D-band, while the packaging loss of the low noise amplifier module with the back-to-back transition is less than 2.2 dB at 120-170 GHz, which indicate that the proposed broadband transition is feasible for millimeter-wave chip packaging.

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