Vertical vias models for LTCC circuits based on BP neural networks

Abstract

The low temperature co-fired ceramics (LTCC) is an ideal packaging method that can be used to design highly reliable and miniature microwave multi-chip modules (MMCM). In this paper, modeling and simulation of the three dimensional vertical interconnection were carried out using three dimensional electromagnetic field analysis software HFSS. The BP neural network was used to forecast the parasitics of the vertical through hole. Good agreement was acquired between the simulated results and experimental results. The goal of this paper is to make the vertical vias as a circuit part, so as to enhance the efficiency of the design and processing of microwave circuits based on the LTCC. Simultaneously, it will also improve the design accuracy of the LTCC microwave circuits, providing the technical support for the design of more complex microwave circuits.