1995
DOI: 10.1016/0038-1101(95)00048-x
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Modern epitaxial techniques for HBT structures

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Cited by 12 publications
(6 citation statements)
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“…1) growth at lower temperature to suppress positively charged interstitial dopants and avoid redistribution of charge under stress conditions [20]; 2) improved passivation techniques in addition to use of ledge to suppress nonideal base currents [17]; 3) use of nonalloyed contacts and also InGaAs emitter cap to improve ohmic contact stability [21]; 4) In co-doping of the base [22]; 5) employment of C-doped GaInP emitter in conjunction with C-doped GaAs base to suppress performance sensitivity to dopant redistribution [23]. All devices used in this investigation were fabricated on wafers grown by metal organic chemical vapor deposition (MOCVD) technique.…”
Section: Hbt Technology and Long Term Reliabilitymentioning
confidence: 99%
“…1) growth at lower temperature to suppress positively charged interstitial dopants and avoid redistribution of charge under stress conditions [20]; 2) improved passivation techniques in addition to use of ledge to suppress nonideal base currents [17]; 3) use of nonalloyed contacts and also InGaAs emitter cap to improve ohmic contact stability [21]; 4) In co-doping of the base [22]; 5) employment of C-doped GaInP emitter in conjunction with C-doped GaAs base to suppress performance sensitivity to dopant redistribution [23]. All devices used in this investigation were fabricated on wafers grown by metal organic chemical vapor deposition (MOCVD) technique.…”
Section: Hbt Technology and Long Term Reliabilitymentioning
confidence: 99%
“…2, that without CBr 4 flow, the C concentration is already very high. Indeed, it is known that under specific growth conditions, a non-negligible amount of carbon comes from the decomposition of TMAl and/or TMIn organometallic sources [2]. More surprisingly on this profile, the In content in InAlAs increases with the flow rate of CBr 4 .…”
Section: Resultsmentioning
confidence: 98%
“…Compared to the more conventional Zn p-type dopant used in metalorganic vapor phase epitaxy (MOVPE), C has a very low diffusion coefficient and extremely high achievable doping levels (41 Â10 19 cm À3 ). This is especially required for the base region of heterojunction bipolar transistors or for the heavily doped contact layers of some optoelectronic devices [1,2]. Using CBr 4 as a source of carbon, Ito and Yokoyama [3] and Ougazzaden et al [4] have reported very high p-type doping levels in MOVPE grown C:InAlAs lattice matched to InP.…”
Section: Introductionmentioning
confidence: 99%
“…So, interesting dopants for heavy p-type doping of base must have a high incorporation rate and a low diffusion coefficient. That is why carbon appears as an attractive alternative to conventionally used p-type impurity such as beryllium [1][2][3][4].…”
Section: Introductionmentioning
confidence: 99%