This study investigates the trapping characteristics present at the interface of AlxGa1‐xN/GaN High‐Electron‐Mobility Transistors (HEMTs) and explores the influence of the Al composition within the AlxGa1‐xN barrier on the device’s performance. Using a single pulse I
D
‐V
D
characterization technique, we evaluated the reliability instability in two different AlxGa1‐xN/GaN HEMTs: one with an Al composition of 25% (Al0.25Ga0.75N/GaN) and the other with an Al composition of 45% (Al0.45Ga0.55N/GaN). The results unveiled a notable higher drain current degradation (ΔI
D
) in Al0.45Ga0.55N/GaN devices, attributed to fast transient charge trapping. Conversely, the Al0.25Ga0.75N/GaN device exhibited a substantial 35% reduction in interface trap density (D
it
) and an impressive 73% decrease in border trap density (N
bt
), solidifying its reduced trapping behavior compared to Al0.45Ga0.55N/GaN due to the rougher barrier/channel interface of the latter device. Furthermore, load‐pull measurements unveiled a noteworthy 60% power‐added efficiency (PAE) for the Al0.25Ga0.75N/GaN device, presenting a 10% performance improvement over the Al0.45Ga0.55N/GaN device. These findings provide valuable insights into the trapping phenomena within AlGaN/GaN HEMTs, paving the way for enhanced device design and performance optimization.This article is protected by copyright. All rights reserved.