“…The most important features of the LTCC technology in respect to microdevices fabrication are the following: 3D structuring, integration of various components in one module, possibility of combining with various materials [10,11,25]. The advantages of LTCC structure, in comparison with silicon one, are as follows: lower price, shorter design and development time and possibility of integration of fluidic channels, heater, sensors and package in one LTCC module [12][13][14][15].…”