The dependence of the ramp geometry on high-or low-angle ion-beam etching, used to structure ramp-type Josephson junctions based on ReBa 2 Cu 3 O 7−δ high-T c superconductors, is investigated by cross-section transmission electron microscopy. The surface quality, interfaces and crystal defects are analysed by high-resolution electron microscopy. Technical difficulties to reproducibly obtain the desired slope angle and shape make high-angle ion-beam etching less interesting although the surface quality is comparable and no systematic differences in electrical properties are observed.