2009
DOI: 10.1016/j.jallcom.2008.11.103
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Microstructural and electrical characteristics of reactively sputtered ZrNx thin films

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Cited by 13 publications
(5 citation statements)
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“…The values are in agreement with the reported data [27,28]. It is a well known fact that crystallinity and stoichiometric ratio strongly affect film resistivity [29]. The total resistivity of the films is a contribution of several independent electron scattering processes due to phonons, impurity atoms and defects [30].…”
Section: Electrical Resistivitysupporting
confidence: 91%
“…The values are in agreement with the reported data [27,28]. It is a well known fact that crystallinity and stoichiometric ratio strongly affect film resistivity [29]. The total resistivity of the films is a contribution of several independent electron scattering processes due to phonons, impurity atoms and defects [30].…”
Section: Electrical Resistivitysupporting
confidence: 91%
“…The stoichiometric variable x increased from 0.92 to 1.00, 1.08, and 1.22 with an increasing f from 0.50 to 0.65, 0.75, and 0.85. This was accompanied by a decrease in the deposition rate from 3.8 to 3.4, 3.1, and 1.9 nm/min as only gun 1 was applied with a DC power of 150 W. The decrease in deposition rate with the increasing f level was caused by the reduced ionization and sputtering yield of N 2 related to Ar gas [34]. Moreover, the well-known target poisoning effect in reactive sputtering reduced the deposition rate [34][35][36].…”
Section: Chemical Compositions and Crystalline Phasesmentioning
confidence: 99%
“…This was accompanied by a decrease in the deposition rate from 3.8 to 3.4, 3.1, and 1.9 nm/min as only gun 1 was applied with a DC power of 150 W. The decrease in deposition rate with the increasing f level was caused by the reduced ionization and sputtering yield of N 2 related to Ar gas [34]. Moreover, the well-known target poisoning effect in reactive sputtering reduced the deposition rate [34][35][36]. The Zr 42 N 58 (1.00) films prepared using an f of 1.00 and sputter power of 150 W on both guns 1 and 2 exhibited an x of 1.38 and a deposition rate of 3.9 nm/min; this deposition rate was almost twice that of the Zr 45 N 55 (0.85) films prepared with a high f level and using gun 1 only.…”
Section: Chemical Compositions and Crystalline Phasesmentioning
confidence: 99%
“…These have also been applied to tools for cutting and forming, to machinery components, aerospace and automotive parts, among others due to their high hardness, wear resistance, thermal stability, oxidation resistance, and chemical stability [1][2][3][4]. To enhance the performance of particular tools, dies, and molds for several applications, hard coating technology is continually being developed.…”
Section: Introductionmentioning
confidence: 99%