Microfluidic electroless deposition for uniform stacking chip interconnection: Simulation framework and experimental validation

Zhang, Yonglin; Yao, Peilun; Han, Yuzi; Yang, Jiachuan; Chen, Haibin; Wu, Jinglai; Yang, Jinglei

doi:10.1016/j.cej.2022.134684

Cited by 11 publications

(1 citation statement)

References 35 publications

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“…Furthermore, it has widespread applications in flip-chip bonding pads , and surface finish layers , because the ENIG layer exhibits excellent wear and corrosion resistance. More importantly, electroless plating is a promising way to achieve the vertical interconnection of chips in low temperature and pressureless condition. − Unfortunately, till now, no attention has been given to the electroless plating to produce bumps for micro-LED integration.…”

Section: Introductionmentioning

confidence: 99%

Electroless Deposition of 4 μm High Ni/Au Bumps for 8 μm Pitch Interconnection

Tian

Lin

Pan

et al. 2022

ACS Appl. Electron. Mater.

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We propose that electroless plating is a superb approach to preparing metallic bumps with an ultrafine pitch for the integration of a micro light-emitting diode (micro-LED). Electroless plating does not suffer from lift-off-related issues, which are ubiquitous in thermal evaporation. Besides, it can result in much more uniform bumps than electroplating because the bump height is not affected by the current distribution. This study reports ultrafine pitch Ni/Au bumps fabricated by electroless nickel immersion gold (ENIG) plating. Furthermore, cheap metals iron and nickel are selected to catalyze the electroless nickel process. The results indicate that uniform and consistent Ni/Au bumps can be obtained through the iron sheet and nickel layer method. Besides, no voids and impurities are found inside the bumps, which is beneficial for the following interconnection process. Moreover, the change in Ni bump height values with the electroless plating time is also provided.

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