Based on transfer printing technology, Micro-LED pixels can be transferred to different types and sizes of driver substrates to realize the display of different application scenarios. To achieve a successful...
We
propose that electroless plating is a superb approach to preparing
metallic bumps with an ultrafine pitch for the integration of a micro
light-emitting diode (micro-LED). Electroless plating does not suffer
from lift-off-related issues, which are ubiquitous in thermal evaporation.
Besides, it can result in much more uniform bumps than electroplating
because the bump height is not affected by the current distribution.
This study reports ultrafine pitch Ni/Au bumps fabricated by electroless
nickel immersion gold (ENIG) plating. Furthermore, cheap metals iron
and nickel are selected to catalyze the electroless nickel process.
The results indicate that uniform and consistent Ni/Au bumps can be
obtained through the iron sheet and nickel layer method. Besides,
no voids and impurities are found inside the bumps, which is beneficial
for the following interconnection process. Moreover, the change in
Ni bump height values with the electroless plating time is also provided.
scite is a Brooklyn-based organization that helps researchers better discover and understand research articles through Smart Citations–citations that display the context of the citation and describe whether the article provides supporting or contrasting evidence. scite is used by students and researchers from around the world and is funded in part by the National Science Foundation and the National Institute on Drug Abuse of the National Institutes of Health.