2010
DOI: 10.1002/pat.1447
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Microfluidic chip fabrication using hot embossing and thermal bonding of COP

Abstract: The application of silicon mold inserts by micro‐hot embossing molding has been explored in microfluidic chip fabrication. For the mold insert, this study employed an SU‐8 photoresist to coat the silicon wafer. Ultraviolet light was then used to expose the pattern on the SU‐8 photoresist surface. This study replicates the microstructure of the silicon mold insert by micro‐hot embossing molding. Different processing parameters (embossing temperature, embossing pressure, embossing time, and de‐molding temperatur… Show more

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Cited by 36 publications
(25 citation statements)
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“…The bond strength was found to vary depending on the area of the disc, with lowest value of 0.6 MPa measured for the samples taken from the outer edge of the disc. However, even the lowest value is still sufficient for leak-tight device operation and comparable to some previously reported data for COP-COP bonded microfluidic chips 4,13 .…”
Section: Bondingsupporting
confidence: 89%
“…The bond strength was found to vary depending on the area of the disc, with lowest value of 0.6 MPa measured for the samples taken from the outer edge of the disc. However, even the lowest value is still sufficient for leak-tight device operation and comparable to some previously reported data for COP-COP bonded microfluidic chips 4,13 .…”
Section: Bondingsupporting
confidence: 89%
“…However, UV adhesive also has some limitations in practice, such as poor tolerance to mechanical shock, radiation, and temperature changes [5]. Moreover, when bonding wafers with microchannels, the microchannels are easy to be plugged by UV adhesive [6].…”
Section: Introductionmentioning
confidence: 99%
“…Microfluidic devices are often created with photolithography and etching procedures, and for cell culture devices, replica molding by soft lithography in the elastomer PDMS. Other methods for creating microfluidic devices include micromachining, micro injection molding, and hot embossing [141][142][143]. Moreover, with the improvement in resolution, 3D printing has emerged as a realistic option that can combine design flexibility and large-scale manufacturability.…”
Section: = µmentioning
confidence: 99%