Microchannel heatsinks for high-average-power laser diode arrays

Beach, Raymond J.; Benett, Bill; Freitas, B.L.; Ciarlo, D.; Sperry, V.; Comaskey, B.; Emanuel, M.A.; Solarz, R.; Mundinger, D.

doi:10.1117/12.59177

Cited by 6 publications

(1 citation statement)

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“…The V-shaped microchannel based on MEMS technology has the advantages of low thermal resistance, low flow quantity, high efficiency and small volume [3]. This cooling scheme can dissipate heat from diode laser arrays and other high power density devices quickly and effectively [4,5]. It can also realize the precise localization of diode laser arrays and microlen arrays, and improve beam quality.…”

Section: Introductionmentioning

confidence: 99%

Research on fluid flow and heat transfer of the V-shaped microchannel heat sink

Han

Liu

Gao

2008

2008 International Conference on Information and Automation

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V-shaped microchannel has the advantages of small volume, low flow velocity and high efficiency. V-shaped microchannel is a cooling scheme which assembled multi diode laser bars into an array to achieve high performance cooling package. The paper adopted fluent software to set up a numerical model of V-shaped microchannel and researched the fluid and heat transfer issues of the V-shaped microchannel. The simulation results show that V-shaped microchannel can improve the heat dissipation performance of the diode laser arrays. The experiment of the simulated load addition of thermal source has been carried out and tested the cooling performance of V-shaped microchannel with the V-shaped microchannel sample. The experimental data is agre ed well with the simulation result and proves the validity of simulation result.

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Section: Introductionmentioning

confidence: 99%

Research on fluid flow and heat transfer of the V-shaped microchannel heat sink

Han

Liu

Gao

2008

2008 International Conference on Information and Automation

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A diode pumped solid state laser driver for inertial fusion energy

1996

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A comprehensive conceptual design for a diode pumped solid state laser (DPSSL) as a driver for an inertial fusion energy (IFE) power plant is presented. This design is based on recent technical advances that offer potential solutions to difficulties previously associated with the use of a laser for IFE applications. The design was selected by using a systems analysis code that optimizes a DPSSL configuration by minimizing the calculated cost of electricity (COE). The code contains the significant physics relevant to the DPSSL driver, but treats the target chamber and balance of plant costs generically using scaling relations published for the Sombrero KrF laser concept. The authors describe the physics incorporated in the code, predict DPSSL performance and its variations with changes in the major parameters, discuss IFE economics and technical risk, and identify the high leverage development efforts that can make DPSSL driven IFE plants more economically competitive. It is believed that this study is a significant advance over previous conceptual studies of DPSSLs for IFE because it incorporates a new cost effective gain medium, applies a potential solution to the 'final optics' problem, and considers the laser physics in substantially greater detail. The result is the introduction of an option for an IFE driver that has relatively low development costs and that builds upon the mature laser technology base already developed for Nova and being developed for the proposed National Ignition Facility. The baseline design of the paper has a product of laser efficiency and target gain of qG -6.6 and a COE of 8.6 centsikW .h for a 1 GW(e) plant with a target gain of 76 at 3.7 MJ.Higher qG ( 2 11) and lower COEs ( 5 6.6 centsikW. h) can be achieved with target gains twice as high.

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Mounting of high power laser diodes on diamond heatsinks

Weiss

Zakel

Reichl

1996

IEEE Trans. Comp., Packag., Manufact. Technol. A

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This work describes the mounting of commercial 1 W laser diodes soldered on chemical vapor deposition ((SVD) diamond heatsinks using Au(SO)Sn(20)-solder. With a standard heatsink metallization, the laser diode suffers under high stress. This can be seen in the power-current characteristic and the spectrum as well as in the near and farfield beam pattern. With a modification of the heatsink metallization layer, it was possible to obtain a reproducible mounting process. We compare the electrical and optical characterization of the typical standard heatsink metallization with the modified metallization. So we are able to qualify the mechanical stress in the laser diode. For a better understanding of the modified metallization SEM and EDX analyses are performed. For the quantification of the stress an analytical model is used to compute the maximal shear, tensile, and peel stress. Furthermore, the quality of the bond interface is investigated with high resolution X-ray microscopy. No voids are found. Additionally, the results of a standard burn& and the first accelerated aging tests to prove the reliability are presented.Index Terms-High power laser diode, die-bonding, diamondheatsink, Au(SO)Sn(20), fluxless.

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Microchannel heatsinks for high-average-power laser diode arrays

Cited by 6 publications

References 0 publications

Research on fluid flow and heat transfer of the V-shaped microchannel heat sink

Research on fluid flow and heat transfer of the V-shaped microchannel heat sink

A diode pumped solid state laser driver for inertial fusion energy

Mounting of high power laser diodes on diamond heatsinks

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