The heat-removal capability of area-interconnect-compatible interlayer cooling in vertically integrated, high-performance chip stacks was characterized with de-ionized water as coolant. Correlation-based predictions and computational fluid dynamic modeling of cross-flow heat-removal structures show that the coolant temperature increase due to sensible heat absorption limits the cooling performance at hydraulic diameters <= 200 mu m. An experimental investigation with uniform and double-side heat flux at Reynolds numbers <= 1,000 and heat transfer areas of 1 cm(2) was carried out to identify the most efficient interlayer heat-removal structure. The following structures were tested: parallel plate, microchannel, pin fin, and their combinations with pins using in-line and staggered configurations with round and drop-like shapes at pitches ranging from 50 to 200 mu m and fluid structure heights of 100-200 mu m. A hydrodynamic flow regime transition responsible for a local junction temperature minimum was observed for pin fin in-line structures. The experimental data was extrapolated to predict maximal heat flux in chip stacks having a 4-cm(2) heat transfer area. The performance of interlayer cooling strongly depends on this parameter, and drops from > 200 W/cm(2) at 1 cm(2) and > 50 mu m interconnect pitch to < 100 W/cm(2) at 4 cm(2). From experimental data, friction factor and Nusselt number correlations were derived for pin fin in-line and staggered structures
This paper shows how common embroidery can be used to integrate electronics into textile environment in a light and cost efficient way. A mechanism has been developed to embroider through flexible electronic modules using conductive yarn, thus creating an interconnection with other modules like sensors, batteries, textile keyboards, etc. Mold encapsulation has been found to improve the electrical contact and support the reliability of the whole system.
The paper addresses the through silicon via (TSV) filling using electrochemical deposition (ECD) of copper. The impact of seed layer nature on filling ratio and void formation will be discussed with respect to via diameter and via depth. Based on the Spherolyte Cu200 the electrolyte for the copper electrochemical deposition was modified for good filling behavior. Thermomechanical modeling and simulation was performed for reliability assessment
scite is a Brooklyn-based organization that helps researchers better discover and understand research articles through Smart Citations–citations that display the context of the citation and describe whether the article provides supporting or contrasting evidence. scite is used by students and researchers from around the world and is funded in part by the National Science Foundation and the National Institute on Drug Abuse of the National Institutes of Health.