1986
DOI: 10.1016/0022-0248(86)90348-9
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Metalorganic chemical vapor deposition of GaAs on Si for solar cell applications

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Cited by 61 publications
(13 citation statements)
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“…Since the thickness of compound semiconductor multijunction solar cells on Si substrates was usually above 4 μm for the improvement of light absorption efficiency [1], [10], [11], they were easily subjected to the crack formation. The cracks were known to behave as scattering centers reducing the light propagation into the layers and to increase the parasitic resistance of devices [5], [12], [13]. Theoretically, it was known that the cracking occurred when the elastic energy induced in an epitaxial GaAs layer on Si due to the mismatch in thermal expansion coefficient exceeded that required to generate two {1 1 0} surfaces [5].…”
Section: G Rowth Of Iii-v Compound Semiconductor Solar Cells Onmentioning
confidence: 99%
“…Since the thickness of compound semiconductor multijunction solar cells on Si substrates was usually above 4 μm for the improvement of light absorption efficiency [1], [10], [11], they were easily subjected to the crack formation. The cracks were known to behave as scattering centers reducing the light propagation into the layers and to increase the parasitic resistance of devices [5], [12], [13]. Theoretically, it was known that the cracking occurred when the elastic energy induced in an epitaxial GaAs layer on Si due to the mismatch in thermal expansion coefficient exceeded that required to generate two {1 1 0} surfaces [5].…”
Section: G Rowth Of Iii-v Compound Semiconductor Solar Cells Onmentioning
confidence: 99%
“…Latticematched 2J InGaP/GaAs solar cells have been the key building block for today's most efficient 3J and quadruple junction (4J) III-V solar cells, with GaAs being predominantly used as the starting substrate. Hence, integration of GaAs-on-Si substrate was the initial and the natural choice for realizing a "GaAs-on-Si" virtual platform for the subsequent multijunction solar cell growth (Vernon et al 1986;Yamaguchi et al 1988;Soga et al 1995). More recently, approaches involving metamorphic graded buffers such as GaAsP and SiGe have gained a lot of attention for III-V/Si tandem solar cells (Grassman, Carlin, and Ringel 2010;Dimroth et al 2014;Diaz et al 2014;Yaung, Lang, and Lee 2014).…”
Section: Heteroepitaxial Approach For Iii-v-on-si Integrationmentioning
confidence: 99%
“…The most noteworthy techniques which have been employed for direct GaAs epitaxy on Si to reduce the threading dislocation density (TDD) include (i) the thermal-cycle annealing (TCA) (Yamaguchi, Nishioka, and Sugo 1989;Yamaguchi 1991) and (ii) the low temperature and low growth rate process during the initial GaAs nucleation on Si (Vernon et al 1986;Tran et al 2012;Yamaguchi, Nishioka, and Sugo 1989;Yamaguchi 1991;Bolkhovityanov and Pchelyakov 2008). Growing thicker GaAs buffers has also been shown to facilitate dislocation reduction (Vernon et al 1986) but adds to the overall cost and time of the epitaxial process. Additionally, thin strained layers (SLs) and superlattices introduced into the bulk GaAs buffer have been shown to facilitate the annihilation of TDs and minimize the dislocation propagation into the active layers of interest.…”
Section: Heteroepitaxial Approach For Iii-v-on-si Integrationmentioning
confidence: 99%
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