1996
DOI: 10.1117/12.250825
|View full text |Cite
|
Sign up to set email alerts
|

<title>Design of the UltraSPARC-I microprocessor for manufacturing performance</title>

Abstract: The 5.2M transistor UItraSPARC(TM)-I microprocessor is manufactured using the 0.5um EPIC3 CMOS QLM process. Design features were implemented to accelerate increases in manufacturing yield and product performance while enabling rapid establishment of high-coverage manufacturing test. Support for production memory defect mapping and repair, scan-based testing and failure analysis, component identity tracking, Iddq testing, per-chip CMOS process parameter monitoring, and aggressive process scalability were includ… Show more

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
1
1
1

Citation Types

0
5
0

Year Published

1997
1997
1997
1997

Publication Types

Select...
4
2

Relationship

0
6

Authors

Journals

citations
Cited by 7 publications
(5 citation statements)
references
References 0 publications
0
5
0
Order By: Relevance
“…2 Direct, pipelined writes and reads allow capture and mapping of all detected failures. The tester generates defect maps for four memory arrays: a 158-Kbit, single-port instruction cache (containing predecode, instruction cache, and instruction tag blocks); a 128-Kbit, single-port data cache; a 15-Kbit, dual-port data cache tag; and a 16-Kbit, dual-port next-field RAM used for instruction address prediction.…”
Section: Sram Testingmentioning
confidence: 99%
“…2 Direct, pipelined writes and reads allow capture and mapping of all detected failures. The tester generates defect maps for four memory arrays: a 158-Kbit, single-port instruction cache (containing predecode, instruction cache, and instruction tag blocks); a 128-Kbit, single-port data cache; a 15-Kbit, dual-port data cache tag; and a 16-Kbit, dual-port next-field RAM used for instruction address prediction.…”
Section: Sram Testingmentioning
confidence: 99%
“…This led to requirements set forth by both the manufacturing and design teams for an embedded-memory test mode. 6 These requirements supported s memory defect mapping for yield improvement and laser repair s compatibility with memory testers and logic testers s minimal dependence on processor logic circuits s compatibility with burn-in test equipment s an effective means for failure isolation . s low area impact s operation at full processor speed s the flexibility to apply any memory test algorithm to the arrays under test…”
Section: Embedded-array Testingmentioning
confidence: 99%
“…Replacement techniques, such as extra rows and columns, are also used in caches for yield enhancement [11] and for tolerating lifetime failures [9] [12]. With replacement techniques, there is no performance loss in caches with faults.…”
Section: Previous Workmentioning
confidence: 99%