Low Voltage Electrostatic Actuation and Displacement Measurement Through Resonant Drive Circuit

Park, Sangtak; Abdel‐Rahman, Eihab

doi:10.1115/detc2012-71268

Cited by 7 publications

(7 citation statements)

References 47 publications

(69 reference statements)

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“…where k is the effective stiffness of the support beams and m is the effective mass of the beams and plate. The electrostatic actuator is driven by a resonant drive circuit [12] made of a resistor, inductor and capacitor connected in series. The size of suspension beam and electrodes is chosen by considering the importance of maintaining the natural frequency away from the carrier frequency since we do not wish to excite the electrostatic actuator at its resonance.…”

Section: Demodulator Modelmentioning

confidence: 99%

Architecture for MEMS-based analogue demodulation

Chung

Park

Abdel‐Rahman

et al. 2013

J. Micromech. Microeng.

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This paper presents a new method for the demodulation of radio frequency (RF) signals using an electrostatic actuator that acts as a mechanical mixer, directly converting RF signals into baseband signals in a homodyne receiver configuration. We investigate the feasibility of demodulating amplitude modulated and frequency modulated signals using the same electrostatic actuator numerically and experimentally. While exciting the actuator with the modulated RF signals, we measure the displacement of the actuator using a vibrometer at various frequencies. We present the operating principle of the micro-electro-mechanical systems (MEMS) demodulator as well as simulation and experiment results demonstrating its success in extracting the baseband signal from various RF signals. We have found that the displacement of the electrostatic actuator is 30.8 nm with a modulated signal input of 48.6 mV corresponding to 32 dB gain.

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Section: Demodulator Modelmentioning

confidence: 99%

Architecture for MEMS-based analogue demodulation

Chung

Park

Abdel‐Rahman

et al. 2013

J. Micromech. Microeng.

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“…Although all the components and processes are well standardized, they introduce additional feedthrough loss, complexity, size, and cost. In addition, it is known that feedthrough noises and losses play a significant role in the electrical actuation and measurements of MEMS and NEMS [ 9 , 10 , 11 , 12 ]. In addition modeling of the parasitic effects of these noise sources was attempted, to minimize the damage [ 13 ].…”

Section: Introductionmentioning

confidence: 99%

“…Sensors 2022, 22, x FOR PEER REVIEW 2 of 16 in the electrical actuation and measurements of MEMS and NEMS [9][10][11][12]. In addition modeling of the parasitic effects of these noise sources was attempted, to minimize the damage [13].…”

Section: Introductionmentioning

confidence: 99%

Built-In Packaging for Single Terminal Devices

Gulsaran

Azer

Kocer

et al. 2022

Sensors

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An alternative packaging method, termed built-in packaging, is proposed for single terminal devices, and demonstrated with an actuator application. Built-in packaging removes the requirements of wire bonding, chip carrier, PCB, probe station, interconnection elements, and even wires to drive single terminal devices. Reducing these needs simplifies operation and eliminates possible noise sources. A micro resonator device is fabricated and built-in packaged for demonstration with electrostatic actuation and optical measurement. Identical actuation performances are achieved with the most conventional packaging method, wire bonding. The proposed method offers a compact and cheap packaging for industrial and academic applications.

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“…Previous works extended this concept using multifrequency excitation signals to increase MEMS filter bandwidth [23,24,25,26], the signal-to-noise ratio in microgyroscope applications, [27] and the harvested energy in MEMS harvester [28]. Finally, as MEMS devices also act as capacitors; electrical resonance was utilized for detection through electrical resonant frequency shift in an RLC circuit [29] and to amplify the MEMS response by forming an LC tank circuit or a resonant drive circuit [30,31]. Triggering electrical resonance in such a circuit leads to a large voltage amplification across the MEMS device.…”

Section: Introductionmentioning

confidence: 99%

Voltage and Deflection Amplification via Double Resonance Excitation in a Cantilever Microstructure

Hasan

Alsaleem

Ramini

2019

Sensors

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Cantilever electrostatically-actuated resonators show great promise in sensing and actuating applications. However, the electrostatic actuation suffers from high-voltage actuation requirements and high noise low-amplitude signal-outputs which limit its applications. Here, we introduce a mixed-frequency signal for a cantilever-based resonator that triggers its mechanical and electrical resonances simultaneously, to overcome these limitations. A single linear RLC circuit cannot completely capture the response of the resonator under double resonance excitation. Therefore, we develop a coupled mechanical and electrical mathematical linearized model at different operation frequencies and validate this model experimentally. The double-resonance excitation results in a 21 times amplification of the voltage across the resonator and 31 times amplitude amplification over classical excitation schemes. This intensive experimental study showed a great potential of double resonance excitation providing a high amplitude amplification and maintaining the linearity of the system when the parasitic capacitance is maintained low.

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Low Voltage Electrostatic Actuation and Displacement Measurement Through Resonant Drive Circuit

Cited by 7 publications

References 47 publications

Architecture for MEMS-based analogue demodulation

Architecture for MEMS-based analogue demodulation

Built-In Packaging for Single Terminal Devices

Voltage and Deflection Amplification via Double Resonance Excitation in a Cantilever Microstructure

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