Low-Temperature Copper Bonding Strategy with Graphene Interlayer

Wang, Haozhe; Leong, Wei Sun; Hu, Fengtian; Ju, Longlong; Su, Cong; Guo, Yukun; Li, Ju; Li, Ming; Hu, Anmin; Kong, Jing

doi:10.1021/acsnano.7b07739

Cited by 52 publications

(30 citation statements)

References 32 publications

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“…In this work, CVD monolayer graphene grown on Cu foil was used because graphene synthesized in this manner is the most widely used source of large-area graphene in state-of-the-art research and industrial development, despite being polycrystalline and having lower mobility values. Details on the process of CVD graphene synthesis are available in our previous work 26 . As can be seen in Fig.…”

Section: Resultsmentioning

confidence: 99%

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Paraffin-enabled graphene transfer

et al. 2019

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The performance and reliability of large-area graphene grown by chemical vapor deposition are often limited by the presence of wrinkles and the transfer-process-induced polymer residue. Here, we report a transfer approach using paraffin as a support layer, whose thermal properties, low chemical reactivity and non-covalent affinity to graphene enable transfer of wrinkle-reduced and clean large-area graphene. The paraffin-transferred graphene has smooth morphology and high electrical reliability with uniform sheet resistance with ~1% deviation over a centimeter-scale area. Electronic devices fabricated on such smooth graphene exhibit electrical performance approaching that of intrinsic graphene with small Dirac points and high carrier mobility (hole mobility = 14,215 cm2 V−1 s−1; electron mobility = 7438 cm2 V−1 s−1), without the need of further annealing treatment. The paraffin-enabled transfer process could open realms for the development of high-performance ubiquitous electronics based on large-area two-dimensional materials.

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Section: Resultsmentioning

confidence: 99%

“…The sample was then rinsed with IPA followed by nitrogen blow dry. We note that all process parameters chosen for the PMMA-supported graphene transfer in this work were adopted from earlier reports 9,10,16,20,26 . A separate experiment was conducted to further verify the advantageous of paraffin support layers over PMMA (Supplementary Note 1).…”

Section: Methodsmentioning

confidence: 99%

Paraffin-enabled graphene transfer

et al. 2019

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“…The growth substrate was subjected to a Ni etchant (Nickel Etchant TFB, Transense) pre‐treatment before loading into a low‐pressure chemical vapor deposition (LPCVD) system. Similar to previous work,35 the growth substrate was then annealed at 1030 °C for 30 min in a hydrogen‐rich environment (10 sccm of H 2 at 320 mTorr). In the next 30 min, the LPCVD system was maintained at 1030 °C and 4 sccm of CH 4 was introduced in addition to 10 sccm of H 2 , for the graphene synthesis.…”

Section: Methodsmentioning

confidence: 99%

Fluidic Flow Assisted Deterministic Folding of Van der Waals Materials

Zhao

Wang

Liu

et al. 2020

Adv Funct Materials

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Origami offers a distinct approach for designing and engineering new material structures and properties. The folding and stacking of atomically thin van der Waals (vdW) materials, for example, can lead to intriguing new physical properties including bandgap tuning, Van Hove singularity, and superconductivity. On the other hand, achieving well-controlled folding of vdW materials with high spatial precision has been extremely challenging and difficult to scale toward large areas. Here, a deterministic technique is reported to fold vdW materials at a defined position and direction using microfluidic forces. Electron beam lithography (EBL) is utilized to define the folding area, which allows precise control of the folding geometry, direction, and position beyond 100 nm resolution. Using this technique, single-atomic-layer vdW materials or their heterostructures can be folded without the need for any external supporting layers in the final folded structure. In addition, arrays of patterns can be folded across a large area using this technique and electronic devices that can reconfigure device functionalities through folding are also demonstrated. Such scalable formation of folded vdW material structures with high precision can lead to the creation of new atomic-scale materials and superlattices as well as opening the door to realizing foldable and reconfigurable electronics.

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“…Consequently, to achieve high-density integration, high performance, and low power consumption, new high-level surface bonding schemes have to be developed. Recently, the process compatibility and reliability of cold bonding between surfaces with patterned arrangements of nanowires, nanoparticles, and nanocones have been improved by studies of the effects of lowering the temperature and pressure for bonding [ 4 , 5 , 6 , 7 , 8 ]. Such nanometal bonding methods exhibit high bonding strength and low electrical resistance at the interface at ambient or low temperatures.…”

Section: Introductionmentioning

confidence: 99%

Computational Study on Surface Bonding Based on Nanocone Arrays

Song

Zhang

2021

Nanomaterials

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Surface bonding is an essential step in device manufacturing and assembly, providing mechanical support, heat transfer, and electrical integration. Molecular dynamics simulations of surface bonding and debonding failure of copper nanocones are conducted to investigate the underlying adhesive mechanism of nanocones and the effects of separation distance, contact length, temperature, and size of the cones. It is found that van der Waals interactions and surface atom diffusion simultaneously contribute to bonding strength, and different adhesive mechanisms play a main role in different regimes. The results reveal that increasing contact length and decreasing separation distance can simultaneously contribute to increasing bonding strength. Furthermore, our simulations indicate that a higher temperature promotes diffusion across the interface so that subsequent cooling results in better adhesion when compared with cold bonding at the same lower temperature. It also reveals that maximum bonding strength was obtained when the cone angle was around 53°. These findings are useful in designing advanced metallic bonding processes at low temperatures and pressure with tenable performance.

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Low-Temperature Copper Bonding Strategy with Graphene Interlayer

Cited by 52 publications

References 32 publications

Paraffin-enabled graphene transfer

Paraffin-enabled graphene transfer

Fluidic Flow Assisted Deterministic Folding of Van der Waals Materials

Computational Study on Surface Bonding Based on Nanocone Arrays

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