Computational Study on Surface Bonding Based on Nanocone Arrays

Abstract

Surface bonding is an essential step in device manufacturing and assembly, providing mechanical support, heat transfer, and electrical integration. Molecular dynamics simulations of surface bonding and debonding failure of copper nanocones are conducted to investigate the underlying adhesive mechanism of nanocones and the effects of separation distance, contact length, temperature, and size of the cones. It is found that van der Waals interactions and surface atom diffusion simultaneously contribute to bonding strength, and different adhesive mechanisms play a main role in different regimes. The results reveal that increasing contact length and decreasing separation distance can simultaneously contribute to increasing bonding strength. Furthermore, our simulations indicate that a higher temperature promotes diffusion across the interface so that subsequent cooling results in better adhesion when compared with cold bonding at the same lower temperature. It also reveals that maximum bonding strength was obtained when the cone angle was around 53°. These findings are useful in designing advanced metallic bonding processes at low temperatures and pressure with tenable performance.

Study on Nanoporous Graphene-Based Hybrid Architecture for Surface Bonding

“…Traditional surface bonding techniques in electronic assembly rely on high-temperature processes such as reflow soldering [ 4 , 5 ] and thermo-compression bonding [ 6 ], which can lead to undesirable thermal damage, toxic solder materials pollution, and a thermal mismatch at the bonding interface. Recently various nanometal materials such as metal nanowires, nanoparticles, and nanocones-based surface bonding are being studied to lower the bonding temperature and pressure [ 7 , 8 , 9 , 10 ]. However, these bonding technologies introducing low deformation resistance joints have been entangled in thermo-mechanical stresses and aging degradation issues, limiting their reliability.…”

Special Issue on Advanced Mechanical Modeling of Nanomaterials and Nanostructures

“…The same computational tool is, moreover, applied by X. Song et al [12] for the computational study of the surface bonding based on nanocone arrays, accounting for the effects of separation distance, contact length, temperature and size of cones. The main findings from [12] have revealed to be useful in designing advanced metallic bonding processes at low temperatures and pressure with tenable performances.…”

“…Song et al [12] for the computational study of the surface bonding based on nanocone arrays, accounting for the effects of separation distance, contact length, temperature and size of cones. The main findings from [12] have revealed to be useful in designing advanced metallic bonding processes at low temperatures and pressure with tenable performances. In line with the previous two works, in the work authored by B. Yang et al [13], the MD is applied to study the thermal stability of the nanotwinned diamond and synthesized nanotwinned cubic boron nitride for nanotwinned structures with enhanced mechanical properties.…”