Low Temperature (180°C) Growth of Smooth Surface Germanium Epilayers on Silicon Substrates Using Electron Cyclotron Resonance Chemical Vapor Deposition
Abstract:This paper describes a new method to grow thin germanium (Ge) epilayers (40 nm) on c-Si substrates at a low growth temperature of 180°C using electron cyclotron resonance chemical vapor deposition (ECR-CVD) process. The full width at half maximum (FWHM) of the Ge (004) in X-ray diffraction pattern and the compressive stain in a Ge epilayer of 683 arcsec and 0.12% can be achieved. Moreover, the Ge/Si interface is observed by transmission electron microscopy to demonstrate the epitaxial growth of Ge on Si and th… Show more
“… 34 − 36 The measured full width at half-maximum of the Ge mode (Γ = 5.1 cm –1 ) in the spectrum is only ∼1.7 cm –1 larger than in the bulk (Γ = 3.4 cm –1 ), 37 which indicates a pure Ge segment of good crystal quality. 38 …”
Section: Resultsmentioning
confidence: 99%
“…To check the internal stress in the Ge segment, probably as part of the manufacturing process, we performed μ-Raman measurements on a 2 μm-wide and 1.5 μm-long Ge segment shown in the inset of Figure a. The Raman spectrum in the main plot reveals two distinct peaks assigned to the Stokes transverse optical (TO) modes of Ge at about 301 cm –1 and the supporting Si handle wafer at 520 cm –1 . − The measured full width at half-maximum of the Ge mode (Γ = 5.1 cm –1 ) in the spectrum is only ∼1.7 cm –1 larger than in the bulk (Γ = 3.4 cm –1 ), which indicates a pure Ge segment of good crystal quality …”
Section: Resultsmentioning
confidence: 99%
“…34−36 The measured full width at half-maximum of the Ge mode (Γ = 5.1 cm −1 ) in the spectrum is only ∼1.7 cm −1 larger than in the bulk (Γ = 3.4 cm −1 ), 37 which indicates a pure Ge segment of good crystal quality. 38 To evaluate the optical and electrical properties of the monolithic Al-Ge-Al heterostructures, we performed photoluminescence (PL) and common I/V measurements. The right inset of Figure 4a shows exemplarily a comparison of the room-temperature near-infrared PL spectra obtained at the Ge segment, the bare device layer, and the Si handle wafer of the GeOI substrate.…”
Low-dimensional Ge
is perceived as a promising building block for
emerging optoelectronic devices. Here, we present a wafer-scale platform
technology enabling monolithic Al-Ge-Al nanostructures fabricated
by a thermally induced Al-Ge exchange reaction. Transmission electron
microscopy confirmed the purity and crystallinity of the formed Al
segments with an abrupt interface to the remaining Ge segment. In
good agreement with the theoretical value of bulk Al-Ge Schottky junctions,
a barrier height of 200 ± 20 meV was determined. Photoluminescence
and μ-Raman measurements proved the optical quality of the Ge
channel embedded in the monolithic Al-Ge-Al heterostructure. Together
with the wafer-scale accessibility, the proposed fabrication scheme
may give rise to the development of key components of a broad spectrum
of emerging Ge-based devices requiring monolithic metal-semiconductor–metal
heterostructures with high-quality interfaces.
“… 34 − 36 The measured full width at half-maximum of the Ge mode (Γ = 5.1 cm –1 ) in the spectrum is only ∼1.7 cm –1 larger than in the bulk (Γ = 3.4 cm –1 ), 37 which indicates a pure Ge segment of good crystal quality. 38 …”
Section: Resultsmentioning
confidence: 99%
“…To check the internal stress in the Ge segment, probably as part of the manufacturing process, we performed μ-Raman measurements on a 2 μm-wide and 1.5 μm-long Ge segment shown in the inset of Figure a. The Raman spectrum in the main plot reveals two distinct peaks assigned to the Stokes transverse optical (TO) modes of Ge at about 301 cm –1 and the supporting Si handle wafer at 520 cm –1 . − The measured full width at half-maximum of the Ge mode (Γ = 5.1 cm –1 ) in the spectrum is only ∼1.7 cm –1 larger than in the bulk (Γ = 3.4 cm –1 ), which indicates a pure Ge segment of good crystal quality …”
Section: Resultsmentioning
confidence: 99%
“…34−36 The measured full width at half-maximum of the Ge mode (Γ = 5.1 cm −1 ) in the spectrum is only ∼1.7 cm −1 larger than in the bulk (Γ = 3.4 cm −1 ), 37 which indicates a pure Ge segment of good crystal quality. 38 To evaluate the optical and electrical properties of the monolithic Al-Ge-Al heterostructures, we performed photoluminescence (PL) and common I/V measurements. The right inset of Figure 4a shows exemplarily a comparison of the room-temperature near-infrared PL spectra obtained at the Ge segment, the bare device layer, and the Si handle wafer of the GeOI substrate.…”
Low-dimensional Ge
is perceived as a promising building block for
emerging optoelectronic devices. Here, we present a wafer-scale platform
technology enabling monolithic Al-Ge-Al nanostructures fabricated
by a thermally induced Al-Ge exchange reaction. Transmission electron
microscopy confirmed the purity and crystallinity of the formed Al
segments with an abrupt interface to the remaining Ge segment. In
good agreement with the theoretical value of bulk Al-Ge Schottky junctions,
a barrier height of 200 ± 20 meV was determined. Photoluminescence
and μ-Raman measurements proved the optical quality of the Ge
channel embedded in the monolithic Al-Ge-Al heterostructure. Together
with the wafer-scale accessibility, the proposed fabrication scheme
may give rise to the development of key components of a broad spectrum
of emerging Ge-based devices requiring monolithic metal-semiconductor–metal
heterostructures with high-quality interfaces.
“…For Ge thin-film characterization, Raman spectroscopy is one of the most commonly used tools to evaluate its crystalline quality, ,,,, i.e., a Raman spectrum can be used to do a qualitative crystalline analysis based on the peak characteristics such as the peak position and its FWHM value. Higher peak intensity with a smaller FWHM value for a germanium peak indicates better crystalline quality with less defect density and larger crystalline domains. , Figure shows the Raman spectra for four GOS samples: 500 nm and 2.0 μm thick films before and after 850 °C thermal annealing.…”
As
an excellent semiconductor material with low band gap and high
carrier mobility, germanium is widely used in the semiconductor industry
in photoelectronic devices, high-frequency radio frequency (rf) circuits
and devices, etc. Compared to bulk germanium wafer and silicon-based
germanium on insulator (GOI) materials, the germanium on sapphire
(GOS) substrate offers a highly cost-effective solution with several
important advantages, including low thermal expansion coefficient
mismatch, high insulator resistivity,
lower rf losses, and superior crosstalk suppression. In this work,
we present a method to grow a high-quality thin germanium epitaxial
film on a sapphire (0001) substrate using direct-current (DC) sputtering
at an elevated temperature of 600 °C. We demonstrate that thermal
annealing at 850 °C reduced the germanium (111) twinning, increased
the size of crystalline domains in the germanium film and thus further
improved the crystalline quality. For a film with a thickness of 500
nm, the hole Hall mobility increased to 440 cm2/V·s
after thermal annealing, which is about 10 times more than that of
the as-sputtered film. For a 2.0 μm film, the hole Hall mobility
increased to 824 cm2/V·s, which has not been reported
in the literature for a GOS film. This method offers a simple but
efficient way to fabricate a GOS substrate for optical electronic
device applications.
“…In this study, we used ECR-CVD to grow Ge epilayers on n-type <100> CZ silicon wafers with a resistivity of 1-10 -cm z E-mail: 102389003@cc.ncu.edu.tw diced at a low growth temperature of 220 • C. The ECR-CVD process provides a number of advantages for the growth of films, such as high crystallinity, less ion damage to the surface, and high deposition rates. 23,24 During process, we modulate the process pressure and main coil current to control the strain in the Ge epilayers. The main coil current is used to control the plasma position in the ECR chamber.…”
In this study, we use electron cyclotron resonance chemical vapor deposition to investigate the strain behavior in Ge epilayers grown on silicon at a low temperature of 220°C. The strain in the Ge epilayers is transformed from compressive (−0.567%) to tensile (0.15%) as the process pressure decreases and main coil current increases. This tensile strain is due to intrinsic stress in the Ge epilayers at high process pressure and low main coil current. Besides, the Ge atoms have higher kinetic energy and shorter mean free path at low process pressure and high main coil current, which causes atomic bombardment effect on the Ge surfaces frequently. Thus, the intrinsic stress in Ge epilayers become compressive. The absorption coefficient of tensile and compressive strain in Ge films are measured using a UV–VIS-NIR spectrophotometer. The results show the absorption coefficients of the tensile strain Ge epilayer has a redshift condition on the absorption edge compare with compressive strain Ge epilayers. Finally, the structure information of the Ge epilayers is identified by atomic force microscopy and transmission electron microscopy. This strain control technology is modulated by film growth parameter, which can adjust the Ge bandgap for the device requirement.
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