2018
DOI: 10.1109/jphotov.2018.2859768
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Low-Resistivity Screen-Printed Contacts on Indium Tin Oxide Layers for Silicon Solar Cells With Passivating Contacts

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Cited by 25 publications
(22 citation statements)
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“…To minimize the temporary influence from the ambient air atmosphere on the static charging effect and to get clear comparative CPD values, repeated measurements were carried out. 34 Besides, the contact resistivity between the 75-nm-thick TCOs and screen-printed silver (SP, Ag) was studied with the transfer length method (TLM) on dedicated samples, 35 as shown in Figure 1a. Wafers with insulating SiO x coating layers were used as substrates to restrict the lateral current flow to the subsequently deposited TCO layers.…”
Section: Methodsmentioning
confidence: 99%
“…To minimize the temporary influence from the ambient air atmosphere on the static charging effect and to get clear comparative CPD values, repeated measurements were carried out. 34 Besides, the contact resistivity between the 75-nm-thick TCOs and screen-printed silver (SP, Ag) was studied with the transfer length method (TLM) on dedicated samples, 35 as shown in Figure 1a. Wafers with insulating SiO x coating layers were used as substrates to restrict the lateral current flow to the subsequently deposited TCO layers.…”
Section: Methodsmentioning
confidence: 99%
“…An important fact is that the addition of Ce results in N > 2 × 10 20 cm −3 , which is a critical factor for device integration, in particular for the formation of lowohmic contacts to charge carrier selective layers and to the metal. 5,24,25,39 As shown in Figure S1, the crystallization kinetics was affected by the incorporation of Ce. The onset temperature thereof significantly increased from around 155 C to 163 C when 0.5 wt% CeO 2 was added but then only slightly rose further (to 165 C) for a CeO 2 increment ≥1 wt%.…”
Section: Electro-optical Film Properties and Crystallization Dynamicsmentioning
confidence: 98%
“…Fingers after NOBLE metallization on the SHJ precursors are characterized in cross‐section by SEM as illustrated in Figure a and c. The metal stack of sputtered Cu (≈50 nm) or Ag (≈20 nm) and plated Cu–Ag are well adhering on the ITO of the SHJ solar cells even with a non‐optimized metal sputtering realized after vacuum interruption (samples were prepared on commercial precursors). No voids or uncontacted area could be noticed as it is regularly the case for printed fingers, which would increase the resistivity at the interface. Otherwise, the ITO thicknesses below the finger and in the non‐contact positions (Figure b) are similar (≈80 nm) − i.e., ITO was not attacked in the etching step.…”
Section: Resultsmentioning
confidence: 90%
“…Metal pastes printed on SHJ solar cells are designed for low‐temperature application, due to the thermal sensitivity of the amorphous layers. As the cells cannot be heated to above 200 °C, the conductivity of the metal paste is relatively low . This problem has been partly reduced by application of the smart wire technology, which can directly interconnect printed contact fingers with small solder‐coated wires that form the module interconnect .…”
Section: Introductionmentioning
confidence: 99%