Low Phase Noise Bond Wire VCO for DVB-H

Kim, Ki‐Jin; Ahn, Kwang–Ho; Lim, T. H.

doi:10.1109/delta.2008.6

Cited by 3 publications

(2 citation statements)

References 5 publications

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“…Packaged VCO with bonding wires as the inductors can improve phase noise significantly, occupy less silicon area and receive less interference from the substrate [1][2][3][4]. Most of the existing packaged VCOs require bonding wires bonded from pads on silicon die to the lead frame of the package.…”

Section: Introductionmentioning

confidence: 99%

1mW 4-5GHz packaged VCO with bonding-to-ground inductors

Shi

Liu

2010

2010 10th IEEE International Conference on Solid-State and Integrated Circuit Technology

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A packaged VCO, which utilizes the heat-sink pad in Quad Flat Pack No-Lead (QFN) package to provide a ground connection for bonding wire inductors, is presented in this paper. The proposed VCO is designed to cover 4 to 5 GHz band and is able to work under a minimum of 0.9 V DC supply voltage with only 1 mW power consumption. It is fabricated in 0.18 μm standard CMOS process. It achieves the FOM of -193 dBc/Hz, and the measured frequency variation is less than 11%.

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Section: Introductionmentioning

confidence: 99%

1mW 4-5GHz packaged VCO with bonding-to-ground inductors

Shi

Liu

2010

2010 10th IEEE International Conference on Solid-State and Integrated Circuit Technology

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“…The suspended air-bridge interconnection fabricated by lift-off process increases the Q of the metal traces or passive components and, thus, increases the output power and efficiency of the active devices [26]. Some papers have applied the bondwires as inductors in RF circuits, such as an active balun [27], low-noise amplifiers [28], [29], and voltage-controlled oscillators [30], [31].…”

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confidence: 99%

2.4-GHz Complementary Metal Oxide Semiconductor Power Amplifier Using High-Quality Factor Wafer-Level Bondwire Spiral Inductor

Lin

Chiou

et al. 2013

IEEE Trans. Compon., Packag. Manufact. Technol.

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A complementary metal oxide semiconductor (CMOS) power amplifier (PA) using a wafer-level bondwire spiral inductor with high-quality factor (Q) is presented. The inductor is made by three top metal traces connected with bondwire loops above the CMOS chip. The proposed inductor with 2.75-nH inductance achieves a Q of 18, which is three times as much as that of a conventional CMOS standard spiral inductor at 2.4 GHz. The Q of the inductor is over 15 from 2 to 14 GHz, which can cover the frequency band of wireless sensor network and worldwide interoperability for microwave access applications. The output power and power-added efficiency of the PA with the inductor are improved by 1.5 dBm and 7% as compared with those of the fully integrated CMOS PA, respectively. Index Terms-Bondwire loop, complementary metal oxide semiconductor (CMOS), power added efficiency (PAE), power amplifier (PA), quality factor (Q), spiral inductor.

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An X-Band low-power and low-phase-noise VCO using bondwire inductor

Peters

Scheytt

2009

Adv. Radio Sci.

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Abstract. In this paper a low-power low-phase-noise voltage-controlled-oscillator (VCO) has been designed and, fabricated in 0.25 μm SiGe BiCMOS process. The resonator of the VCO is implemented with on-chip MIM capacitors and a single aluminum bondwire. A tail current filter is realized to suppress flicker noise up-conversion. The measured phase noise is −126.6 dBc/Hz at 1 MHz offset from a 7.8 GHz carrier. The figure of merit (FOM) of the VCO is −192.5 dBc/Hz and the VCO core consumes 4 mA from a 3.3 V power supply. To the best of our knowledge, this is the best FOM and the lowest phase noise for bondwire VCOs in the X-band. This VCO will be used for satellite communications.

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Low Phase Noise Bond Wire VCO for DVB-H

Cited by 3 publications

References 5 publications

1mW 4-5GHz packaged VCO with bonding-to-ground inductors

1mW 4-5GHz packaged VCO with bonding-to-ground inductors

2.4-GHz Complementary Metal Oxide Semiconductor Power Amplifier Using High-Quality Factor Wafer-Level Bondwire Spiral Inductor

An X-Band low-power and low-phase-noise VCO using bondwire inductor

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