2015
DOI: 10.1016/j.optlaseng.2015.03.017
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Laser Beam MicroMachining (LBMM) – A review

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Cited by 227 publications
(101 citation statements)
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“…Short laser pulses of (sub)-ps range find great interests in material processing, notably in fields like micro-machining for surface functionalization during last few decades [1][2][3]. Under intense irradiation of short pulse, dielectrics first experience moderate excitation via nonlinear photoionization; then, the generated conduction band electrons undergo rapid multiplication by repeated process of laser heating (inverse Bremsstrahlung) and impact ionization.…”
Section: Introductionmentioning
confidence: 99%
“…Short laser pulses of (sub)-ps range find great interests in material processing, notably in fields like micro-machining for surface functionalization during last few decades [1][2][3]. Under intense irradiation of short pulse, dielectrics first experience moderate excitation via nonlinear photoionization; then, the generated conduction band electrons undergo rapid multiplication by repeated process of laser heating (inverse Bremsstrahlung) and impact ionization.…”
Section: Introductionmentioning
confidence: 99%
“…The mechanism of material removal during this process includes different stages: (a) melting, (b) vaporization (pyrolytic processes) and (c) chemical degradation (chemical bonds are broken which causes the degradation of machined material-photolytic process). When a high energy density laser beam is focused on workpiece surface the thermal energy is absorbed which heats and transforms the work volume into a molten, vaporized or chemically changed state that can easily be removed by flow of high pressure assist gas jet [1]. LBM is a thermal process; this means the effectiveness of this process depends on thermal properties and the optical properties (to a certain extent) rather than the mechanical properties of the machined material.…”
Section: Introductionmentioning
confidence: 99%
“…It is widely used in processing of materials [218], such as cutting, welding, marking and sintering. Besides that, it is also used in assisting the cutting of brittle materials, such as the silicon [209] and sapphire [210].…”
Section: Influence Of Brittle Materialsmentioning
confidence: 99%