Front-surface fabrication of moderate aspect ratio micro-channels in fused silica by single picosecond Gaussian–Bessel laser pulse

Liu, Xin; Sanner, N.; Sentís, M.; Stoian, Razvan; Zhao, Wei; Cheng, Guanghua; Utéza, O.

doi:10.1007/s00339-018-1634-1

Cited by 11 publications

(12 citation statements)

References 17 publications

(17 reference statements)

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“…4), we observe that the diameter of the channel does not vary significantly, in agreement with previous experiments and dedicated analysis [20]. Using post-mortem polishing procedure, it is possible to further decrease the aspect ratio by removing calibrated thicknesses of matter at the sample surface, as also demonstrated in [20]. This way, taper-free holes with even smaller aspect ratio (in the range 1-5) and diameter opening below the upper wavelength of visible range are reachable when small-energy 1 ps pulses are used.…”

Section: Channelsupporting

confidence: 92%

“…Moreover, comparing the in-depth transverse profiles at different depths (using for example the case of energy of 0.36 µJ in Fig. 4), we observe that the diameter of the channel does not vary significantly, in agreement with previous experiments and dedicated analysis [20]. Using post-mortem polishing procedure, it is possible to further decrease the aspect ratio by removing calibrated thicknesses of matter at the sample surface, as also demonstrated in [20].…”

Section: Channelsupporting

confidence: 87%

“…It basically consists of an axicon (Altechna, 1-APX-2-H254-P, n = 1.45, nominal base angle = 1°) providing a first Bessel region, and a 4f demagnification optical system (with a factor of 50) made of a lens (f 1 = 500 mm) and a microscope objective (20 ×, NA = 0.4, f 2 = 10 mm, Mitutoyo NIR, working distance 20 mm) to get a second Bessel region (with half conical angle of 21.4° in air) adapted for micromachining. The setup and characteristics of the optical elements used are the same as in [20] except that here we further tailor the beam by inserting specially designed annular apertures in the beam path, just after the axicon. apex, which leads to the typical horn-shape at the beginning of the Gaussian-Bessel beam and the intensity oscillations along the propagation axis [24,27].…”

Section: Generation and Characterization Of A Short-dof Beam By Truncmentioning

confidence: 99%

“…Despite the effectiveness of short-pulse-duration Gaussian-Bessel beams for drilling high aspect ratio channels, it is quite challenging to precisely manipulate the characteristics of the fabricated holes and to access diverse aspect ratios. In our previous work [20], we demonstrated the front-surface fabrication of moderate aspect ratio micro-channels in fused silica by Gaussian-Bessel laser pulse of picosecond (ps) duration. High quality taper-free channels with excellent cylindrical shape, mean diameter of ~1.2 µm and length of ~40 μm were fabricated.…”

Section: Introductionmentioning

confidence: 99%

See 3 more Smart Citations

Truncated Gaussian-Bessel beams for short-pulse processing of small-aspect-ratio micro-channels in dielectrics

Liu¹,

Li²,

Sikora³

et al. 2019

Opt. Express

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In order to control the length of micro-channels ablated at the surface of dielectrics, we use annular filtering apertures for tailoring the depth of focus of micrometric Gaussian-Bessel beams. We identify experimentally and numerically the appropriate beam truncation that promotes a smooth axial distribution of intensity with a small elongation, suitable for processing micro-channels of small aspect ratio. Single-shot channel fabrication is demonstrated on the front surface of a fused silica sample, with sub-micron diameter, highquality opening, and depth of few micrometers, using 1 ps low-energy (< 0.45 µJ) pulse. Finally, we realize 10 × 10 matrices of densely packed channels with aspect ratio ~5 and a spatial period down to 1.5 μm, as a prospective demonstration of direct laser fabrication of 2D photonic-crystal structures.

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Section: Channelsupporting

confidence: 92%

Section: Channelsupporting

confidence: 87%

Section: Generation and Characterization Of A Short-dof Beam By Truncmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

See 2 more Smart Citations

Truncated Gaussian-Bessel beams for short-pulse processing of small-aspect-ratio micro-channels in dielectrics

Liu¹,

Li²,

Sikora³

et al. 2019

Opt. Express

View full text Add to dashboard Cite

show abstract

“…In particular, finite-energy Bessel beams (BB) [5] have been the object of intense research and applications in different fields. Thanks to their self-reconstruction property, their elongated focal zone (orders of magnitude longer than the Rayleigh range of a Gaussian beam focused down to the same core dimension) and the capacity of maintaining a smooth longitudinal fluence profile under both linear propagation and nonlinear propagation [6], BB have been used in micromanipulation [7], microscopy [8], micro-and nanostructuring [9][10][11][12][13][14][15][16] and cutting [17][18][19][20] of transparent materials.…”

Section: Introductionmentioning

confidence: 99%

Etching and drilling of through-holes in thin glass by means of picosecond Bessel beams

2019

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In this paper, we present a laser etching and drilling technique for thin glass materials based on the use of finite-energy pulsed Bessel beams orthogonally impinging on the sample surface. Thanks to the elongated focal zone of the quasinon-diffractive beam, the laser processing can be performed without scanning the beam position along the thickness of the transparent material sample, but simply moving the sample in the plane orthogonal to the beam. We first present the results of single-shot glass microfabrication performed to identify the optimal laser parameters needed for an efficient internal material ablation. We then describe the micromachining technique used for etching the dielectric material at glass-air interfaces and for generating, without chemical etching, through-holes in thin glasses.

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Engraving Depth‐Controlled Nanohole Arrays on Fused Silica by Direct Short‐Pulse Laser Ablation

Liu

Clady

Grojo

et al. 2023

Adv Materials Inter

Self Cite

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face plasmon resonances, and fostered the development of advanced sensors. [2,3] Fabricated on dielectric materials, arrays of nano-holes -and more generally regularly-ordered structures composed of subwavelength-diameter holes -form the basis of the architecture of integrated two-dimensional photonic crystals and all-dielectric metasurfaces, able to confine and manipulate light at unprecedented levels (including amplitude, spectral and spatial management). [4] The usual technological approaches for such nanofabrication of both plasmonic and all-dielectric nanostructures rely on various tools and approaches, amongst which focused ion beam, electron beam, photolithography, reactive ion etching, etc. [5,6] These fabrication methods are mature and highly performant, however, they are slow and they require several steps and techniques that need to be optimized for each material used, thereby inevitably increasing the overall costs and complexity of the whole process.Future advanced devices are now calling for making use of the third dimension (Z) in addition to perfectly well controlled planar nanopatterns (in X and Y dimensions). [7] In particular, arrangements made of arrays of nanoholes with depths reaching at least several micrometers may greatly broaden the range of possible designs and functionalities of nanophotonic structures. [7,8] However, the technological fabrication of such deep holes with a cylindrical profile at the surface of materials is challenging. [9][10][11][12] Thus, introducing a versatile fabrication technique that adds the hole depth as a straightforward and independent degree of freedom holds promises to form advanced architectures. In this context, we explore ultrafast laser processing as a direct way to create deep air holes at the surface of a reference dielectric material, fused silica. By "direct" we mean that one hole is fabricated by a single-step process, consisting in only one laser shot to ablate matter, without any extra treatment (like chemical etching for example [13] ) nor translation of the target material. [14] Although the ultimate spatial resolution of direct laser ablation with ultrashort pulses has not reached yet sufficient performance standards to compete with traditional nanofabrication processes to fabricate functional nanophotonic components, our aim is to show it represents a route for an alternative and complementary solution with attractive advantages in terms of speed, maskless and single-step process, absence of need of vacuum environment or chemicals. Additionally, the nanostructures can be fabricated on a single

show abstract

Front-surface fabrication of moderate aspect ratio micro-channels in fused silica by single picosecond Gaussian–Bessel laser pulse

Cited by 11 publications

References 17 publications

Truncated Gaussian-Bessel beams for short-pulse processing of small-aspect-ratio micro-channels in dielectrics

Truncated Gaussian-Bessel beams for short-pulse processing of small-aspect-ratio micro-channels in dielectrics

Etching and drilling of through-holes in thin glass by means of picosecond Bessel beams

Engraving Depth‐Controlled Nanohole Arrays on Fused Silica by Direct Short‐Pulse Laser Ablation

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