2016
DOI: 10.1063/1.4939936
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Investigation of significantly high barrier height in Cu/GaN Schottky diode

Abstract: Current-voltage (I-V) measurements combined with analytical calculations have been used to explain mechanisms for forward-bias current flow in Copper (Cu) Schottky diodes fabricated on Gallium Nitride (GaN) epitaxial films. An ideality factor of 1.7 was found at room temperature (RT), which indicated deviation from thermionic emission (TE) mechanism for current flow in the Schottky diode. Instead the current transport was better explained using the thermionic field-emission (TFE) mechanism. A high barrier heig… Show more

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Cited by 35 publications
(25 citation statements)
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“…In other words, the decrease in Φ B0 and the increase in n with decreasing temperatures are also evidence that the termionic field emission (TFE) at an intermediate temperature or field emission (FE) at a low temperature is possibly the other current-transport mechanisms. 15,26 It is clear that the values of Φ B0 increase with increasing temperature for the as-deposited and annealed SCs and that is also in agreement with what is reported for the negative temperature coefficient of the bandgap of the semiconductor or ideal diode. This result shows that the current-conduction mechanism in the as-deposited and annealed (Ni/Pt) SCs on AlInGaN quaternary alloy deviates considerably from the pure TE theory especially at low temperature.…”
Section: T (K)supporting
confidence: 87%
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“…In other words, the decrease in Φ B0 and the increase in n with decreasing temperatures are also evidence that the termionic field emission (TFE) at an intermediate temperature or field emission (FE) at a low temperature is possibly the other current-transport mechanisms. 15,26 It is clear that the values of Φ B0 increase with increasing temperature for the as-deposited and annealed SCs and that is also in agreement with what is reported for the negative temperature coefficient of the bandgap of the semiconductor or ideal diode. This result shows that the current-conduction mechanism in the as-deposited and annealed (Ni/Pt) SCs on AlInGaN quaternary alloy deviates considerably from the pure TE theory especially at low temperature.…”
Section: T (K)supporting
confidence: 87%
“…The changes in both n and Φ B0 with temperature for the SCs on the semiconductor materials could be associated with the existence of a spatial inhomogeneity in the BHs that consists extensively of lower and higher barriers or patches with different areas. [17][18][19][20][21][22][23][24][25][26][27]23,24,35 In other words, current can preferentially flow through the lower BH or patches and lead to an important increase in n value.…”
Section: Resultsmentioning
confidence: 99%
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“…The XPS results showing small peaks at 943.2 and 962.4 eV which may be ascribed to 3d 9 shell of the Cu ions, which suggest the presence of a small concentration of oxides of copper and is inconsistent with the XRD results. [35,36]…”
Section: ¼ Kl Bcosqmentioning
confidence: 99%
“…As a consequence, the Fermi level of the semiconductor gets pinned relative to the band edges and the Schottky barrier height (SBH) becomes nearly constant irrespective of the metal on the other side, violating the Schottky-Mott rule (/ Bn ¼ / m À v s ). [4][5][6][7][8] The large concentration of defects on the surface of GaN also results in tunnelling of carriers in the forward bias and large leakage current in reverse biased Schottky barrier diodes (SBDs), [9][10][11] degrading the device performance and reliability.…”
mentioning
confidence: 99%