1985
DOI: 10.1063/1.95665
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Investigation of short time donor annihilation in silicon

Abstract: We have investigated the annealing of the oxygen donor in silicon in the temperature range 550–700 °C using Heatpulse lamp annealing in the time range of 1–1200 s. As-grown silicon wafers can contain donors due to cooling through 450 °C as a part of the crystal growth process. A 1-s anneal at 650 °C is sufficient to eliminate these donors completely. Intentionally created donors were annealed in order to determine reaction kinetics. A second-order process involving the donor plus another species fits the data,… Show more

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Cited by 19 publications
(6 citation statements)
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“…The same value is found for p-type material. It corresponds to the results of other investigations of the donor annihilation between 550 and 650 "C [5], differs, however, from En, = 2.7 eV given by Fuller and Logan [3] for annihilation experiments between 515 and 590 "C.…”
Section: (2)supporting
confidence: 81%
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“…The same value is found for p-type material. It corresponds to the results of other investigations of the donor annihilation between 550 and 650 "C [5], differs, however, from En, = 2.7 eV given by Fuller and Logan [3] for annihilation experiments between 515 and 590 "C.…”
Section: (2)supporting
confidence: 81%
“…Annealing at temperatures between 550 and 650 "C reduces the concentration of OD2's. The activation energy for their annihilation is determined to be E,, = 1.7eV [5], which equals that for the growth of TD1 to TD9. Therefore, similar diffusion-controlled processes are presumed for the growth of T D s and the annihilation of OD2's.…”
Section: Od1 and Od2 Us T H R D Donorsmentioning
confidence: 99%
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