Integrated Microfluidic Cooling and Interconnects for 2D and 3D Chips

Dang, Bing; Bakir, Muhannad S.; Sekar, Deepak; King, C.; Meindl, J.D.

doi:10.1109/tadvp.2009.2035999

Cited by 107 publications

(64 citation statements)

References 21 publications

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“…Single-phase cooling refers to the heat removal by a coolant that remains in liquid state and rises in temperature inside the heat sink (sensible heat absorption). Several prototype 2D and 3D ICs have been built to demonstrate that single-phase liquid cooling has superior cooling capabilities compared to air cooling [3,4].…”

Section: Introductionmentioning

confidence: 99%

STEAM: A fast compact thermal model for two-phase cooling of integrated circuits

Sridhar

Madhour

Atienza

et al. 2013

2013 IEEE/ACM International Conference on Computer-Aided Design (ICCAD)

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Two-phase liquid cooling of computer chips via microchannels etched directly on silicon dies is a potential long-term solution to enable continued integration of high-performance multiprocessors. Two-phase cooling refers to the heat removal via evaporation of a refrigerant flowing inside a heat sink. While possessing superior cooling properties, largescale use of this technology in the industry is limited by the lack of thermal modeling tools that can accurately predict temperatures in a two-phase cooled IC. In this paper, we propose STEAM, a new compact thermal model for 2D/3D ICs with two-phase cooling via silicon microchannels. The accuracy of the STEAM model is validated against measurements from a real two-phase cooled IC test stack reported previously in literature. Temperatures were predicted with an average error as low as 10.2% for uniform heat fluxes and 6.9% for hotspots. Finally, the STEAM model is applied to a realistic 3D multiprocessor system-on-chip (3D MPSoC) with two-phase cooling to simulate IC temperatures and the refrigerant pumping power, demonstrating the applicability of STEAM in the early-stage design of near-future high-performance computers with two-phase cooling.

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Section: Introductionmentioning

confidence: 99%

STEAM: A fast compact thermal model for two-phase cooling of integrated circuits

Sridhar

Madhour

Atienza

et al. 2013

2013 IEEE/ACM International Conference on Computer-Aided Design (ICCAD)

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“…Prototypes of 3-D chips with interlayer microchannel heat sinks have been shown to handle up to 250 W/cm 2 of hot spot heat fluxes, demonstrating the scalability of interlayer liquid cooling [8], [9]. Enhanced heat transfer geometries, such as pin fins, have also been built as an alternative to microchannels, improving the heat transfer characteristics at the cost of higher unpredictability in coolant flow patterns [7], [21].…”

Section: A Liquid Cooling Utilization In 3-d Icsmentioning

confidence: 99%

“…1) is a viable and scalable cooling solution for 3-D MPSoCs. Prototypes of 3-D interlayer waterbased liquid-cooled packages have demonstrated the superior cooling capabilities of this technology, the corresponding reduction in the cooling energy, and also the relative ease with which the current CMOS processes can be modified for manufacturing liquid-cooled systems [7]- [9].…”

mentioning

confidence: 99%

GreenCool: An Energy-Efficient Liquid Cooling Design Technique for 3-D MPSoCs Via Channel Width Modulation

Sabry¹,

Sridhar²,

Meng

et al. 2013

IEEE Trans. Comput.-Aided Des. Integr. Circuits Syst.

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Abstract-Liquid cooling using interlayer microchannels has appeared as a viable and scalable packaging technology for 3-D multiprocessor system-on-chips (MPSoCs). Microchannelbased liquid cooling, however, can substantially increase the onchip thermal gradients, which are undesirable for reliability, performance, and cooling efficiency. In this paper, we present GreenCool, an optimal design methodology for liquid-cooled 3-D MPSoCs. GreenCool simultaneously minimizes the cooling energy for a given system while maintaining thermal gradients and peak temperatures under safe limits. This is accomplished by tuning the heat transfer characteristics of the microchannels using channel width modulation. Channel width modulation is compatible with the current process technologies and incurs minimal additional fabrication costs. Through an extensive set of experiments, we show that channel width modulation is capable of complementing and enhancing the benefits of temperatureaware floorplanning. We also experiment with a 16-core 3-D system with stacked dynamic random-access memory, for which GreenCool improves energy efficiency by up to 53% with respect to no channel modulation.

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“…Hence, it is touted as a long-term green energy solution for next-generation datacenters [6]. Prototypes of 2-D and 3-D stacked ICs with microchannel liquid cooling have been built by various research groups around the world with promising results [3], [7], [8]. An example from IBM is shown in Fig.…”

mentioning

confidence: 99%