Integrated Flip-Chip Flex-Circuit Packaging for Power Electronics Applications

High Performance Silicon Carbide Power Packaging—Past Trends, Present Practices, and Future Directions

“…In 2004, another integrated flip-chip module incorporating a flex-circuit was demonstrated to have 40% lower voltage overshoot and 24% lower losses as a result of implementing wire bondless techniques [55]. Figure 11 shows the schematic of the module and the electrical benefits of the flip-chip bonding method over commercially available discrete devices.…”

High-Temperature High-Power Packaging Techniques for HEV Traction Applications

“…There are a wide variety of these methods, some of which are based on metal clips or structures [19][20][21][22][23][24], while other methods are based on ceramic [25][26][27] or polymeric interconnect structures placed on top of the device [28][29][30][31][32]. All of these methods seek to use alternative methods to make the top side electrical connections without wire bonds.…”

High-Temperature High-Power Packaging Techniques for HEV Traction Applications

“…Another way in which the industry has worked to eliminate the problems associated with wire bonds is through the use of novel assembly methods which make connections to both sides of the devices with solder or braze alloys. There are a wide variety of these methods, some of which are based on metal clips or structures [19][20][21][22][23][24], while other methods are based on ceramic [25][26][27] or polymeric interconnect structures placed on top of the device [28][29][30][31][32]. All of these methods seek to use alternative methods to make the top side electrical connections without wire bonds.…”