High-Temperature High-Power Packaging Techniques for HEV Traction Applications

Barlow, F.; Elshabini, A

doi:10.2172/921886

Cited by 3 publications

(3 citation statements)

References 26 publications

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“…Today, thermoset polymeric materials, mostly silicone gels, are widely used as encapsulants in power modules (4,27). However, they are designed for use in a temperature range below 175°C.…”

Section: Encapsulationmentioning

confidence: 99%

“…The purpose of encapsulation is to protect the power chips, embedded passive components and interconnections from external environmental damage and to prevent arcing between the chip surface and adjacent metal features. Today, thermoset polymeric materials, mostly silicone gels, are widely used as encapsulants in power modules (4,27). However, they are designed for use in a temperature range below 175°C.…”

Section: Encapsulationmentioning

confidence: 99%

“…However, power module packages aimed at these potential applications are still in an early phase of development. One of the most crucial concerns is to ensure long-term reliability under severe thermal stress (4). High Tj and large thermal excursions (∆Tj) often cause package components to deteriorate in a short period of time (5,6).…”

Section: Introductionmentioning

confidence: 99%

See 2 more Smart Citations

Packaging Techniques for Compact SiC Power Modules Operable in an Extended Tj Range

Tanimoto

Watanabe²,

Tanisawa

et al. 2013

ECS Trans.

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Packaging technology applicable to SiC power devices operated in an extended junction temperature range (Tjmax > 200°C) must be developed in order to create much more compact and cost-effective SiC power modules. This paper describes some of the technical challenges involved in improving the reliability of the critical package components—die attachment system, Al wire bonds and encapsulation—in direct contact with SiC devices inside the power module. Two numerical targets, (I) 3000 hours for a storage test at 250°C and (II) 3000 cycles for thermal cycling between -40°C and 250°C, were achieved through optimization and various improvements.

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Section: Encapsulationmentioning

confidence: 99%

Section: Encapsulationmentioning

confidence: 99%