Inkjet Printing of Conductive Silver Patterns by Using the First Aqueous Particle-Free MOD Ink without Additional Stabilizing Ligands

Abstract

The chemical and physical properties of [AgO 2 C(CH 2 OCH 2 ) 3 H] (3) and its use as an aqueous, ligand-free MOD ink (MOD = metal-organic decomposition) for piezo inkjet printing is discussed. The printed, thermal, or photochemical sintered silver features are electrically conductive on glass (2.7 Â 10 7 S m -1 ) and PET (PET = polyethylene terephthalate) substrates (1.1 Â 10 7 S m -1 ) corresponding to 43% and 18% of the bulk silver conductivity. Conducted tape tests show the suitability of the ink for particularly polymer substrates. TG-MS studies demonstrate a two-step decomposition for the conversion of 3 to elemental silver. The structure of 3 in the solid state was determined by single X-ray structure determination.

Research Status and Prospects of Particle-Free Silver Conductive Ink

“…Using inkjet printing technology, the resulting silver film resistivity was 1.37 x 10 -5 Ω.cm. Stephan F. Jahn [28] also uses silver nitrate as the precursor, triethylamine as the complexing agent, and 2-[2-(2-methoxyethoxy) ethoxy] acetic acid as the solvent, configured as a the particle-free conductive ink was found to have a reduction temperature of 100-250°C. If it is desired to obtain better conductivity under low-temperature reduction, it requires a longer reduction time (reduction time in the text is 5 to 60 minutes).…”

Amorphous InGaZnO Thin Film Transistor Fabricated with Printed Silver Salt Ink Source/Drain Electrodes

“…Silver possesses excellent conductivity and anti-oxidation properties, thus silver based inks show a potential application in fabrication of high performance electrodes of TFT by inkjet printing [7][8][9][10]. Silver based ink could be divided into two types: one is based on silver nanoparticles [11][12][13] and the other is silver salt ink [14][15][16]. Organic polymers as a disperse stabilizer are inevitably presented in nanoparticle inks to prevent aggregation of silver nanoparticles [13], and can be usually removed by high temperature sintering or high-intensity light curing [17], to facilitate the merging of silver nanoparticles.…”

“…Organic polymers as a disperse stabilizer are inevitably presented in nanoparticle inks to prevent aggregation of silver nanoparticles [13], and can be usually removed by high temperature sintering or high-intensity light curing [17], to facilitate the merging of silver nanoparticles. In contrast, the silver salt could be stably dissolved in the solvent without the disperse stabilizer [15], and could be thermally self-reduced to metallic silver at low temperatures [18,19].…”

Selective adsorption of catalyst and copper plating for additive fabrication of conductive patterns and through-holes

“…Inkjet printing of conductive ink is extensively researched recently [5][6][7][8][9][10][11][12][13][14][15][16][17][18]. But excessive sintering temperature, poor electrical property and extremely high cost limit its applications.…”