Selective adsorption of catalyst and copper plating for additive fabrication of conductive patterns and through-holes

Chang, Yu; Tao, Youshan; Zhang, Qun; Yang, Zhen‐Guo

doi:10.1016/j.electacta.2015.01.161

Cited by 50 publications

(37 citation statements)

References 30 publications

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“…For any flexible integrated circuit, the ability to integrate multiple, discrete components into a functional system is of crucial importance. 34 However, THT metallization was difficult to be performed on fibrous substrates due to their flexibility and stretchability. When the switch turned on, the two LEDs illuminated simultaneously, which indicated that both sides showed excellent conductivity.…”

Section: The Application Of the Textile-based Dual-side Cu Patternsmentioning

confidence: 99%

Fabrication of dual-side metal patterns onto textile substrates for wearable electronics by combining wax-dot printing with electroless plating

Zhao

Hou

et al. 2016

J. Mater. Chem. C

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Textile wearable electronics offer the consolidated advantages of both electronics and textile characteristics. Wearable electronic systems typically require conductive tracks as platform to form the integration of electronic components. Herein we developed a site-selective electroless plating process to construct dual-side Cu patterns onto textile substrates. The proposed craft was mainly comprised of four procedures, namely, 3-aminopropyltrimethoxysilane (APTMS)-modification, wax-pattern printing, selective Au-seeding and Cu-patterns deposition. Specifically, waxes were transferred from commercial wax impregnated papers to APTMS modified fabrics with the aid of a conventional stylus printer. Intensive waxed dots then composed a wax pattern which corresponded to the input image designed on the computer. The wax pattern acted as a hydrophobic mask on the fabric surface and hindered the covered areas from being activated by subsequent Au catalysts. The non-covered areas, in contrast, were APTMS naked surfaces which normally adsorbed Au nanoparticles and had Cu tracks grown. The minimum width of the Cu track was 400 μm with 3.57 % deviation and the typical resistivity was 7.52 μΩ cm, which was about 4.6 times of the bulk metal Cu (at room temperature). The reliabilities of textile-based conductive Cu patterns were confirmed by Air-exposure, Ultrasonic washing and Scotch®-tape tests. In addition, the universality and versatility of the proposed method were validated by fabricating different metal patterns on various types of flexible substrates.

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Section: The Application Of the Textile-based Dual-side Cu Patternsmentioning

confidence: 99%

Fabrication of dual-side metal patterns onto textile substrates for wearable electronics by combining wax-dot printing with electroless plating

Zhao

Hou

et al. 2016

J. Mater. Chem. C

View full text Add to dashboard Cite

show abstract

“…Metal particles, such as Ag [3], Cu [4] and Ni [5], in-situ plated on substrate surface with excellent interfacial characterization and dispersion, which meet all the requirements on filler of antistatic coating [6]. The key of the electroless plating reaction is the establishment of catalytic site on polymer surface, so that the plating metal ions were catalyzed reduction metal coating process of formation [7,8].…”

Section: Introductionmentioning

confidence: 99%

“…As a result, the introduction of active group, the adsorption of catalyst and electroless plating (three-step process) are the common technology for electroless plating [10,11]. Huang et al [9], Wang et al [12] and Chang et al [8] found that the modified polyethylene terephthalate surface with -NH2 and -SH on its surface could absorb Ag particles, acting as catalytic center, so that the Cu coatings are deposited through REDOX reaction in the presence of catalytic centers. By far the most catalytic sites, such as metal particle (Ni [13], Cu [14], Pd [5] and Ag [9]), defect [15] and active group [16] has been reported.…”

Section: Introductionmentioning

confidence: 99%

A Facile Method Combined with Acetic Acid Modification and Electroless Plating to Fabricate Copper-plated Nylon 12 Powder for Antistatic Coating

Sun¹,

Wan²,

Jiang³

et al. 2021

Rev. Chim.

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Metal particle could deposited on Nylon 12 (PA12) surface using electroless plating with excellent interface and distribution, but the use of noble metal as catalytic site would increase the process cost and restrict its application. In this work, we employed a facile technology combined with acetic acid etching and electroless copper plating to prepare Cu/PA12 composite powder, and it used as conductive filler for antistatic coating was also studied. Results manifested defects (hole and amorphous structure) and amide group established on etched PA12 surface, which would facilitate the destruction of the [Cu-EDTA] structure, and then the reduction of REDOX barrier. As a result, Cu and Cu2O particles deposited on its surface. The downward trend of volume resistivity of antistatic coating appeared the rule of slow-fast-slow. The lowest volume resistivity was about 105 ohm�cm. This means that the dependable technology has great potential application in preparing metal/polymer composite material at a low cost.

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“…Zhang et al inkjet‐printed a palladium salt–based catalytic ink combined with ELD to fabricate high‐quality copper patterns on a high‐porosity paper–based substrate. Nevertheless, it is quite hard for catalytic inks to adhere tightly to smooth polymer surfaces without combinative functional groups or mechanical bonding points . Although these researches provide a good way to fabricate metal layer on flexible substrate, surprisingly little attention has been devoted to the adhesion and quality of metal layer.…”

Section: Introductionmentioning

confidence: 99%

Flexible RFID Tag Metal Antenna on Paper‐Based Substrate by Inkjet Printing Technology

Wang

Yan

Cheng

et al. 2019

Adv Funct Materials

123

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A reliable and low-cost solution-processing procedure to synthesize a highly adhesive flexible metal antenna with low resistivity for radio-frequency identification device (RFID) tags on paper substrates via inkjet printing combined with surface modification and electroless deposition (ELD) is demonstrated in this paper. Through the surface modification of colloidal solution of hydrolyzed stannous chloride and chitosan solution, the paper-based substrate is able to reduce the penetration rate of ink and further increase the adsorption amount of silver ions, which could create a catalytic activating layer to catalyze the subsequent ELD of a conductive deposited metal antenna. The resulting metal antenna for RFID tags presents good adhesive strength and low resistivity of 2.58 × 10 −8 Ω·m after 40 min of ELD, and maintains a reliable reading range of RFID tags even after over 1000 times of bending and mechanical stress. Consequently, the developed technology proposed allows for cheap, efficient, and massive production of metal antenna for paper-based RFID tags with excellent mechanical and electrical properties. Furthermore, this process is especially advantageous for the fabrication of next-generation flexible electronic devices based on paper substrates.The ORCID identification number(s) for the author(s) of this article can be found under https://doi.org/10.1002/adfm.201902579.identification technology in IOT. [2] Different kinds of substrates have been applied to fabricate RFID tags, including polyethylene terephthalate, [3][4][5] polyethylene naphthalate, [6][7][8] polyimide (PI), [9][10][11] and paper. [12,13] Paper is not only widely available, inexpensive, and well established but also lightweight, biodegradable, and can be creased for storage in small spaces or made into 3D self-standing structures; [14,15] so it is an ideal flexible substrate for RFID tags. Using paper as an insulating substrate, it is possible to fabricate RFID tags i) that do not need extra coarsening process because of enough surface roughness; [16] ii) that can naturally degrade; [17] iii) that is an abundantly available renewable material; [18] iv) that involves little absorption of electromagnetic energy due to its low dielectric constant and loss tangent angle. [19][20][21][22] Commercial paper-based RFID tags comprise metal antenna, integrated circuit (IC), and paper substrate, of which metal antenna accounts for 80% of the whole tag cost. [23] At present, the most mature method for preparing metal antenna RFID tag based on organic plastic substrate in industry is the subtractive etching method. [24] Although this traditional method of manufacturing metal antenna shows some superior characteristics, including high accuracy, low resistivity, and good weather resistance, it does generate some disadvantages such as high cost, restriction about substrate type, and environmental pollution. [20,25] In addition, the damage to fiber structure in paper substrate cannot be avoided due to the oxidation of fiber by the strong acid etching s...

show abstract

Selective adsorption of catalyst and copper plating for additive fabrication of conductive patterns and through-holes

Cited by 50 publications

References 30 publications

Fabrication of dual-side metal patterns onto textile substrates for wearable electronics by combining wax-dot printing with electroless plating

Fabrication of dual-side metal patterns onto textile substrates for wearable electronics by combining wax-dot printing with electroless plating

A Facile Method Combined with Acetic Acid Modification and Electroless Plating to Fabricate Copper-plated Nylon 12 Powder for Antistatic Coating

Flexible RFID Tag Metal Antenna on Paper‐Based Substrate by Inkjet Printing Technology

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