Infrared Detectors for the Future

Abstract

In the paper, fundamental and technological issues associated with the development and exploitation of the most advanced infrared detector technologies are discussed. In this class of detectors both photon and thermal detectors are considered. Special attention is directed to HgCdTe ternary alloys on silicon, type-II superlattices, uncooled thermal bolometers, and novel uncooled micromechanical cantilever detectors. Despite serious competition from alternative technologies and slower progress than expected, HgCdTe is unlikely to be seriously challenged for high-performance applications, applications requiring multispectral capability and fast response. However, the nonuniformity is a serious problem in the case of LWIR and VLWIR HgCdTe detectors. In this context, it is predicted that type-II superlattice system seems to be an alternative to HgCdTe in long wavelength spectral region. In well established uncooled imaging, VO x microbolometer arrays are clearly the most used technology. In spite of successful commercialization of uncooled microbolometers, the infrared community is still searching for a platform for thermal imagers that combine affordability, convenience of operation, and excellent performance. Recent advances in microelectromechanical systems have led to the development of uncooled IR detectors operating as micromechanical thermal detectors. Between them the most important are biomaterial microcantilevers.

Investigation of Free Space Optical Detection Module Operating at the Wavelength Range of 8-12 μm

“…Buffer, absorber and contact layer thicknesses are chosen to create a resonant cavity along with the contact metallization. The cavity is not particularly perfect but offers an increase in device quantum efficiency in the long-wave range [9,10].…”

Analytical model for the electro-thermal feedback effect in a microbolometer infrared focal plane array

“…[1][2][3] As the density of IRFPA has rapidly increased, several technical challenges, such as process technology, optical fill-factor, thermal isolation, and the thermal drift of their characteristics, have emerged. [4][5][6][7][8][9][10][11] The accurate performance prediction of the high-density microbolometer IRFPA is also one of the emerging challenges. [8][9][10][11][12][13][14][15][16] In order to make a reasonable performance prediction of a highly optimized and high-density microbolometer IRFPA, the correct understanding of the electro-thermal phenomena that occur in a microbolometer IRFPA is essentially required.…”

“…[4][5][6][7][8][9][10][11] The accurate performance prediction of the high-density microbolometer IRFPA is also one of the emerging challenges. [8][9][10][11][12][13][14][15][16] In order to make a reasonable performance prediction of a highly optimized and high-density microbolometer IRFPA, the correct understanding of the electro-thermal phenomena that occur in a microbolometer IRFPA is essentially required. Since the electro-thermal effect is related to the temperature change and the electronic state change of a sensing material, this effect is inherent in a thermal detector like the microbolometer.…”

Growth process, characterization, and modeling of electronic properties of coupled InAsSbP nanostructures

“…Since these materials utilize direct transitions of electrons, they have a high response speed compared with thermal detectors. 1 Correspondingly, they are highly interesting for various applications where such a high response speed detector system is needed. More efficient alternatives to direct band-gap detectors are based on the intersubband transitions in quantum-confined heterostructures.…”