2011
DOI: 10.1016/j.egypro.2011.06.170
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Influence of the Front Surface Passivation Quality on Large Area n-Type Silicon Solar Cells with Al-Alloyed Rear Emitter

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Cited by 27 publications
(9 citation statements)
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“…Recently, alloying of screen-printed aluminum pastes has appeared as a technologically alternatives to boron diffusion. It allows a simplified p þ emitter fabrication on n-type silicon wafers, and has become of growing interest in solar cell production Singh et al (2011), Rauer et al (2011), Moehlecke et al (2013), Woehl et al (2011) Book et al (2011) Green (2003). The quality of Al-doped p þ Si (Al-p þ ) region is a crucial issue http://dx.doi.org/10.1016/j.solener.2015.04.043 0038-092X/Ó 2015 Elsevier Ltd. All rights reserved.…”
Section: Introductionmentioning
confidence: 99%
“…Recently, alloying of screen-printed aluminum pastes has appeared as a technologically alternatives to boron diffusion. It allows a simplified p þ emitter fabrication on n-type silicon wafers, and has become of growing interest in solar cell production Singh et al (2011), Rauer et al (2011), Moehlecke et al (2013), Woehl et al (2011) Book et al (2011) Green (2003). The quality of Al-doped p þ Si (Al-p þ ) region is a crucial issue http://dx.doi.org/10.1016/j.solener.2015.04.043 0038-092X/Ó 2015 Elsevier Ltd. All rights reserved.…”
Section: Introductionmentioning
confidence: 99%
“…A passivação com camadas de SiO 2 /SiN x resultou na velocidade de recombinação dos minoritários em superfície de 2,4 cm/min em lâminas de Si-Cz tipo n passivadas com SiO 2 crescido termicamente [20]. Em células solares com campo retrodifusor frontal com baixa concentração em superfície de fósforo, a passivação com camadas de SiO 2 /SiN x resultou em um aumento da eficiência de aproximadamente 0,5 % (absoluto), quando comparada com a passivação de SiN x depositado por PECVD [21].…”
Section: Introductionunclassified
“…Today, alloying from screen-printed aluminum pastes is commonly used for the formation of the rear contact of silicon solar cells [1][2][3][4][5][6][7]. Thereby, an aluminum-doped p + Si (Al-p + ) region forms at the surface of the silicon wafer beneath the metal contact, which acts as back surface field for p-type and as rear emitter for n-type Si solar cells, and shields electrons from the recombination-active contact [8][9][10][11].…”
Section: Introductionmentioning
confidence: 99%