No abstract

Boron and oxygen contamination in Czochralski-grown (Cz) silicon leads to a degradation of the minority charge carrier lifetime within short times due to the formation of recombination active complexes. The formation of these complexes is investigated for longer times showing a further development of the defect. This development called 'regeneration' is triggered by illumination or applied forward voltages and leads to a new state of the defect. This new state of the defect is proven to be less recombination active allowing higher stable minority carrier lifetimes and conversion efficiencies of solar cells. The influences of temperature and light intensity are discussed.

A new reaction model concerning the boron-oxygen related degradation is presented, introducing a third recombination inactive state, that stabilizes the electrical parameters of Cz-Si solar cells, and the transition to this new inactive state is proven by experimental data. Furthermore, the stability under solar cell working conditions and the formation kinetics of this additional state are discussed.

Great advances have been achieved in the development of silver pastes. The use of smaller silver particles, higher silver content, and, thus, less glass frit allow modern silver pastes to contact high resistive emitters without the necessity of a selective emitter or subsequent plating. To identify the microscopic key reasons behind the improvement of silver paste, it is essential to understand the current transport mechanism from the silicon emitter into the bulk of the silver finger. Two current transport theories predominate: i) The current flows through the Ag crystallites grown into the Si emitter, which are separated by a thin glass layer or possibly in direct contact with the silver finger.ii) The current is transported by means of multistep tunneling into the silver finger across nano-Ag colloids in the glass layer, which are formed at optimal firing conditions; the formation of Ag crystallites into the Si surface is synonymous with over-firing. In this study, we contact Si solar cell emitters with different silver pastes on textured and flat silicon surfaces. A sequential selective silver-glass etching process is employed to expose and isolate the different contact components for current transport. The surface configurations after the etching sequences are observed with scanning electron microscopy. Liquid conductive silver is then applied to each sample and the contact resistivity is measured to determine the dominant microscopic conduction path system. We observe glass-free emitter areas at the tops of the pyramidal-textured Si that lead to the formation of direct contacts between the Ag crystallites grown into the Si emitter and the bulk of the silver finger. We present experimental evidence that the major current flow into the silver finger is through these direct contacts.

We show that the lateral spread of silicon in a screen-printed aluminum layer increases by (1.50±0.06) μm/°C, when increasing the peak firing temperature within an industrially applicable range. In this way, the maximum spread limit of diffused silicon in aluminum is predictable and does not depend on the contact area size but on the firing temperature. Therefore, the geometry of the rear side pattern can influence not only series resistance losses within the solar cell but the process of contact formation itself. In addition, too fast cooling lead to Kirkendall void formations instead of an eutectic layer.