Physical understanding of printed thick-film front contacts of crystalline Si solar cells—Review of existing models and recent developments

Schubert, Gunnar; Huster, Frank; Fath, P.

doi:10.1016/j.solmat.2006.03.040

Cited by 164 publications

(121 citation statements)

References 6 publications

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“…The predominant technique for formation of electrical contacts is screen printing of a Ag-based thick-film paste and firing through the ARC layer providing very low sheet resistivity (down to 0.015 -1 for 40 μm thick layer) [215][216][217]. More than 85% of all silicon SCs are made with such thick film contacts [215].…”

Section: Solar Cellsmentioning

confidence: 99%

Metal-based Inkjet Inks for Printed Electronics

Kamyshny¹,

Steinke²,

Magdassi

2011

TOAPJ

367

242

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Abstract:A review on applications of metal-based inkjet inks for printed electronics with a particular focus on inks containing metal nanoparticles, complexes and metallo-organic compounds. The review describes the preparation of such inks and obtaining conductive patterns by using various sintering methods: thermal, photonic, microwave, plasma, electrical, and chemically triggered. Various applications of metal-based inkjet inks (metallization of solar cell, RFID antennas, OLEDs, thin film transistors, electroluminescence devices) are reviewed.

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Section: Solar Cellsmentioning

confidence: 99%

Metal-based Inkjet Inks for Printed Electronics

Kamyshny¹,

Steinke²,

Magdassi

2011

TOAPJ

367

242

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“…Our EDX reveals no Ag crystallites present at the overfired glass/Si interface, which is different from previous reports of appearance of Ag particles. [9][10][11][12] The following theory explains why no Ag particles (only Pb) exist in the interface in the overfired paste PB/Si. Figure 6 (left) illustrates a growth mechanism of Ag crystallites at the glass/Si interface under the normal paste firing.…”

Section: Resultsmentioning

confidence: 99%

Investigation of the effect of forming gas annealing on front silver electrodes of c‐Si solar cells

Ren

Yang

Bao³

et al. 2012

Surface & Interface Analysis

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a Forming gas annealing (FGA) is an effective process to repair low efficiency crystalline silicon (c-Si) solar cells with overfired screen-printed paste electrodes. An experimental study was performed to investigate the effect and mechanism of FGA treatment on front silver electrodes of c-Si cells. To facilitate the FGA mechanistic study, special simulation samples were prepared to magnify the FGA effects on glass frit and overfired electrodes. The micro-morphology (from cross-sectional X-SEM) and elemental composition (from energy-dispersive X-ray spectroscopy) data revealed few Ag crystallites in the paste/Si interface because of the thick glass layer from the paste overfiring. The FGA treatment induced phase crystallization (from X-ray diffraction) in the paste and increased the glass wettability on both Si and Ag substrates, thus resulting in a thinner glass layer, which expedited the precipitation of more pyramidal Ag crystallites at the Ag/Si interface. The wetting angle data of glass samples measured before and after FGA confirmed the mechanism of FGA and concluded that the improvement of glass wettability benefited to reduce the glass layer thickness. As a result, more Ag crystallites diffused toward and precipitated at the Si interface contributing to a lower contact resistance between the paste electrode and the Si matrix and thus improved electrical properties for overfired c-Si cells.

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“…The overall reaction sequence has been shown to involve dissolution of Ag into the glass and reduction by Si to form crystallites, but the exact conduction mechanismsome direct connections or only tunnelling in a similar fashion to TFRs (next section) and the role of PbO in the frit are still somewhat elusive. 43 53 or by firing in pure oxygen. 52 These results allow removal of lead from what has become a high volume industry.…”

Section: Metallisations and Tf Conductorsmentioning

confidence: 99%

“…1) (iii) encapsulation of semiconductor devices 29,30 (iv) overglazing of automotive, packaging and architectural glass 33,34,[46][47][48] (v) photovoltaic (PV) solar cell technology -conductors and contacts 42,43,[49][50][51][52][53] (vi) enamelling of aluminium in architecture and home appliances 35,[54][55][56][57][58] (vii) thick film (TF) electronics and other devices 21,22,24,25,27,59 on various substrates: 60 glasses for TF resistor (TFR), 61,62 conductor, 63,64 overglaze, dielectric 65 and sealing [15][16][17][18][19] materials (Fig. 1, the section on 'PbO in low melting frits and TF technology'); especially, special low firing compositions for fabrication of circuits and sensors on glass or metals.…”

Section: Introduction Low Melting Glasses In Electronics and Other Apmentioning

confidence: 99%

Review of Bi₂O₃ based glasses for electronics and related applications

Maeder

2013

International Materials Reviews

146

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The present work critically reviews the scientific and patent literature on low melting bismuth based oxide glass frits in materials for electronics, sensors and related applications such as sealing glasses, solar cells, architectural and automotive glass, the main motivation being to replace lead based materials by environmentally more benign ones. Due to similar glass forming properties of Bi and Pb, Bi based glasses are the closest 'drop-in' alternative for lead bearing formulations, and are therefore actually replacing them in many applications, helped also by previous experience with Bi containing materials in thick film technology and component metallisations. The outstanding issues are discussed, e.g. matching the lowest processing temperatures achieved by the classical lead based glasses without sacrificing durability and stability, as well as stability versus chemical reduction. Finally, consideration is also given to special 'heavy' glasses (often containing Bi and Pb together) that are useful in fields such as optics, superconductors and nuclear technology, as well as to specific Bi 2 O 3 containing crystalline compounds.Keywords: Glasses, Bismuth, Bi 2 O 3 , Electronics, Optics, Thick film technology, Sensors Introduction Low melting glasses in electronics and other applicationsAs for ceramics, inorganic glasses, glass-ceramic and glaze materials have long gone beyond their traditional uses to address a wide array of modern technological challenges, Owing to performance and cost criteria, most standard glasses have relatively high softening points. However, there are many technological applications where a low softening temperature is required, in order to lower energy expenditure, avoid damaging devices in contact with the glass during processing or ensure compatibility with other materials:(i) hermetic sealing of packages, lamps, electrical feedthroughs and semiconductor devices 13,14,16,17,19,44,45 (ii) hermetic sealing and mechanical attachment of sensors 23,27 ( Fig. 1) (iii) encapsulation of semiconductor devices 29,30 (iv) overglazing of automotive, packaging and architectural glass 33,34,[46][47][48] (v) photovoltaic (PV) solar cell technology -conductors and contacts 42,43,[49][50][51][52][53] (vi) enamelling of aluminium in architecture and home appliances 35,[54][55][56][57][58] (vii) thick film (TF) electronics and other devices 21,22,24,25,27,59 (Fig. 1, the section on 'PbO in low melting frits and TF technology'); especially, special low firing compositions for fabrication of circuits and sensors on glass or metals. 1,28,[66][67][68][69][70][71][72] For these applications, glasses are often formulated as frits (e.g. finely divided powder), which may be applied, dispersed in a suitable medium, onto a substrate by various methods such as slip casting, screen printing, roller/curtain coating, spraying, dispensing and electrophoresis, or as preforms for sealing. Classically, the aforementioned applications have to a great extent used lead based glasses, which have a rather unique combinat...

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Physical understanding of printed thick-film front contacts of crystalline Si solar cells—Review of existing models and recent developments

Cited by 164 publications

References 6 publications

Metal-based Inkjet Inks for Printed Electronics

Metal-based Inkjet Inks for Printed Electronics

Investigation of the effect of forming gas annealing on front silver electrodes of c‐Si solar cells

Review of Bi₂O₃ based glasses for electronics and related applications

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Physical understanding of printed thick-film front contacts of crystalline Si solar cells—Review of existing models and recent developments

Cited by 164 publications

References 6 publications

Metal-based Inkjet Inks for Printed Electronics

Metal-based Inkjet Inks for Printed Electronics

Investigation of the effect of forming gas annealing on front silver electrodes of c‐Si solar cells

Review of Bi2O3 based glasses for electronics and related applications

Contact Info

Product

Resources

About

Review of Bi₂O₃ based glasses for electronics and related applications