2011
DOI: 10.1016/j.solmat.2011.01.007
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Industrial high-rate (∼14nm/s) deposition of low resistive and transparent ZnOx:Al films on glass

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Cited by 32 publications
(21 citation statements)
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“…8 There are several deposition techniques applied to synthesize ZnO, such as sol-gel, 14 spray pyrolisis, 15 magnetron sputtering, [16][17][18] pulsed laser deposition, 19,20 atomic layer deposition, 21,22 and metalorganic chemical vapor deposition (MO-CVD). 23 Gas phase-based techniques, as MO-CVD, have also shown potential to grow high quality aluminumdoped ZnO (ZnO:Al) layers 24,25 at deposition rates as high as $14 nm/s 26 on a large surface area (>10 cm 2 ). 25,26 In the plasma CVD techniques, the overall heat load of the process is lowered, as the substrate temperature is reduced down to the range of 100-200 C. For example, in the past years, we have shown that the expanding thermal plasma (ETP) leads to good quality ZnO:Al layers deposited up to 1 nm/s with a resistivity of 8 Â 10 À4 X cm for 1100 nm film thickness, at a substrate temperature of 200 C, as reported by Volintiru et al 27 One of the drawbacks of the CVD processes, [27][28][29] unlike the sputtering approach, is the development of a gradient in resistivity as function of the film thickness, usually present over a large thickness range.…”
Section: Introductionmentioning
confidence: 99%
“…8 There are several deposition techniques applied to synthesize ZnO, such as sol-gel, 14 spray pyrolisis, 15 magnetron sputtering, [16][17][18] pulsed laser deposition, 19,20 atomic layer deposition, 21,22 and metalorganic chemical vapor deposition (MO-CVD). 23 Gas phase-based techniques, as MO-CVD, have also shown potential to grow high quality aluminumdoped ZnO (ZnO:Al) layers 24,25 at deposition rates as high as $14 nm/s 26 on a large surface area (>10 cm 2 ). 25,26 In the plasma CVD techniques, the overall heat load of the process is lowered, as the substrate temperature is reduced down to the range of 100-200 C. For example, in the past years, we have shown that the expanding thermal plasma (ETP) leads to good quality ZnO:Al layers deposited up to 1 nm/s with a resistivity of 8 Â 10 À4 X cm for 1100 nm film thickness, at a substrate temperature of 200 C, as reported by Volintiru et al 27 One of the drawbacks of the CVD processes, [27][28][29] unlike the sputtering approach, is the development of a gradient in resistivity as function of the film thickness, usually present over a large thickness range.…”
Section: Introductionmentioning
confidence: 99%
“…In view of a possible industrial upscale of this AP-CVD process, multiple-passes (i.e., 3 passes) of the glass substrate in the deposition region (at a speed of 150 mm/ min) have been performed (as described in Ref. [21]) to deposit thick (1056 nm) ZnO x :Al films, which are used as front electrode in p i n a-Si:H solar cells, presented in this paper.…”
Section: Methodsmentioning
confidence: 99%
“…A high deposition rate is particularly important for solar cell application, since high production throughputs are required for solar cells' manufacturing to achieve an economy of scale. Recently, we have shown that ZnO x :Al films can be grown at very high deposition rates (up to $ 14 nm/s) on a movable glass substrate, by means of a metalorganic CVD process at atmospheric pressure (AP-MOCVD) [21]. In this paper we investigate the effect of deposition temperature (from 380 1C to 540 1C) on the film growth, both experimentally and numerically.…”
Section: Introductionmentioning
confidence: 99%
“…5,6 The industrial needs for deposition processes with highthroughput, low production costs, and no damage to the substrate (e.g., no bombardment by energetic ions) has driven the development of alternative techniques to sputtering for the growth of TCOs, such as atmospheric pressure CVD, low pressure expanding-thermal-plasma metalorganic-CVD, atmospheric pressure PE-CVD, and atmospheric pressure spatial atomic-layer-deposition (spatial-ALD). [7][8][9][10] Spatial-ALD combines the advantages of conventional ALD (e.g., superior control of film composition, growth of uniform, pinhole free, and highly conformal thin-films on large area and flexible substrates) with high deposition rates (up to $nm/s). 11 For this reason, atmospheric pressure spatial-ALD is emerging as an industrially scalable technique for the deposition of thin film electrodes (e.g., ZnO) and encapsulation (e.g., by Al 2 O 3 thin-films) of solar and electronic devices.…”
Section: Introductionmentioning
confidence: 99%