Improvement of microsystem throughput using new cooling system

Abstract

This paper presents a new possibility of clock frequency/voltage control in microsystems i.e. high performance processors, exploiting information about cooling efficiency. In this paper, we propose an approach that better exploits the thermal abilities of a chip fixed to cooling system in order to eliminate its energy accumulation. For the purpose of the proposed method, the calculation of so called time shift (TS) is introduced. TS is defined as the duration where the computational system can perform the task at higher frequency without any thermal violation when the chip temperature is close to critical thermal threshold. The analogy between thermal and electrical parameters allows to model RC thermal compact model of structure (chip fixed to the cooling system). Based on this assumption, the authors compute the TS value versus different parameters using RC thermal compact model in Spice environment. The results indicate that TS could fulfil a significant part of die total working time. As an effect the proposed approach may be a means for increasing average clock frequency or voltage supply, consequently enhancing the system's throughput.

Effective approach of microprocessor throughput enhancement

“…The thermal throttling approach used in this work is theoretically described in this section. It is well explained in our previous works (Samake et al , 2016a, 2016b, 2016c, 2017a, 2017b; Kocanda et al , 2016). An additional study has been carried out to showcase the advantage of the approach.…”

“…To achieve this goal, many authors have proposed different tools and approaches. A combination of an active fan and a passive heatsink is the most often used approach (Samake et al , 2016a, 2016b, 2016c). The heat generated in the integrated circuit (IC) is transferred to a heatsink, which is in turn cooled by a fan.…”

The Influence of an Additional Sensor on the Microprocessor Temperature

“…As already mentioned in the foregoing section, the sensor temperature differs from the CPU value that we are mainly interested in. A correction has been made, see Equation (5), so that the correct CPU temperature is obtained in steady-state conditions. However, we want to find out how much difference is obtained in case of a thermal transient problem.…”

“…In previously published papers, the authors presented a new idea: one additional temperature sensor, placed on the heat sink. Measuring the temperature difference between the processor and heat sink yields valuable information, which is able to improve the microprocessor's throughput without any changes in its design [4,5]. The theoretical research of these articles was supplemented with experiments using a portable computer: MSI U270 (Micro-Star International Co., Ltd).…”