The Influence of an Additional Sensor on the Microprocessor Temperature

Mey, G. De; Kos, Andrzej

doi:10.3390/en13123156

Cited by 3 publications

(2 citation statements)

References 26 publications

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“…The increasing miniaturization of integrated circuits, combined with their increasing operational capabilities, is resulting in increased heat generation [60,61]. This requires increasingly efficient cooling systems.…”

Section: Introductionmentioning

confidence: 99%

The Influence of Geometry, Surface Texture, and Cooling Method on the Efficiency of Heat Dissipation through the Heat Sink—A Review

Grochalski,

Rukat,

Jakubek

et al. 2023

Materials

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The performance of a heat sink is significantly influenced by the type of cooling used: passive or active (forced), the shape of the heat sink, and the material from which it is made. This paper presents a review of the literature on the influence of geometry and surface parameters on effective heat transfer in heat sinks. The results of simulation studies for three different heat sink fin geometries and cooling types are presented. Furthermore, the influence of the surface texture of the heat sink fins on the heat transfer efficiency was determined. It was shown that the best performance in terms of geometries was that of a wave fin heat sink. When the surface texture was analyzed, it was found that an increase in the amplitude values of the texture decreases the heat dissipation efficiency in the case of active cooling, while for passive cooling, an increase in these parameters has a beneficial effect and increases the effective heat transfer to the surroundings. The cooling method was found to be the most important factor affecting heat dissipation efficiency. Forced airflow results in more efficient heat transfer from the heat sink fins to the surroundings.

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Section: Introductionmentioning

confidence: 99%

The Influence of Geometry, Surface Texture, and Cooling Method on the Efficiency of Heat Dissipation through the Heat Sink—A Review

Grochalski,

Rukat,

Jakubek

et al. 2023

Materials

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“…The paper [42] concerns the problem of a temperature sensor inserted into the neighborhood of a chip to monitor the junction temperature. The presented investigation results prove that it is possible to increase the power dissipation in certain periods of time without the temperature rising over the assumed limit and to increase the microprocessor's throughput by 7%.…”

Section: Introductionmentioning

confidence: 99%

Cooling Systems of Power Semiconductor Devices—A Review

Górecki

Posobkiewicz

2022

Energies

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In this paper, a detailed review of contemporary cooling systems of semiconductor devices is presented. The construction and the principles of operation of selected components of passive and active cooling systems, as well as selected computer tools supporting the design of such systems, are described. The dependences of thermal parameters calculated using these tools on selected factors characterizing the used cooling systems, e.g., the dimensions of their components, are presented and discussed. Additionally, some results of measurements illustrating the influence of selected parameters on the thermal resistance of power MOSFETs mounted in different cooling systems are shown. The properties of selected cooling systems are compared, and it is shown that by changing the type of cooling system, it is possible to reduce the thermal resistance value of a power MOSFET even 20 times. The presented considerations can make the process of designing cooling systems more effective.

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A 0.026 mm2 Time Domain CMOS Temperature Sensor with Simple Current Source

Park

Byun

2020

Micromachines

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This paper presents a time domain CMOS temperature sensor with a simple current source. This sensor chip only occupies a small active die area of 0.026 mm2 because it adopts a simple current source consisting of an n-type poly resistor and a PMOS transistor and a simple current controlled oscillator consisting of three current starved inverter delay cells. Although this current source is based on a simple architecture, it has better temperature linearity than the conventional approach that generates a temperature-dependent current through a poly resistor using a feedback loop. This temperature sensor is designed in a 0.18 μm 1P6M CMOS process. In the post-layout simulations, the temperature error was measured within a range from −1.0 to +0.7 °C over the temperature range of 0 to 100 °C after two point calibration was carried out at 20 and 80 °C, respectively. The temperature resolution was set as 0.32 °C and the temperature to digital conversion rate was 50 kHz. The energy efficiency is 1.4 nJ/sample and the supply voltage sensitivity is 0.077 °C/mV at 27 °C while the supply voltage varies from 1.65 to 1.95 V.

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The Influence of an Additional Sensor on the Microprocessor Temperature

Cited by 3 publications

References 26 publications

The Influence of Geometry, Surface Texture, and Cooling Method on the Efficiency of Heat Dissipation through the Heat Sink—A Review

The Influence of Geometry, Surface Texture, and Cooling Method on the Efficiency of Heat Dissipation through the Heat Sink—A Review

Cooling Systems of Power Semiconductor Devices—A Review

A 0.026 mm2 Time Domain CMOS Temperature Sensor with Simple Current Source

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