Improved strength of boron-doped Sn-1.0Ag-0.5Cu solder joints under aging conditions

Choi, Hee Cheul; Lee, Tae‐Kyu; Kwon, Hoon; Tseng, Chien-Fu; Duh, Jenq‐Gong; Choe, Heeman

doi:10.1016/j.intermet.2011.09.008

Cited by 24 publications

(3 citation statements)

References 35 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Aging treatment method can quickly and effectively reflect the growth behavior of intermetallic compound, which is an effective method in examining the reliability of the new type of solder. Through analyzing the IMC layer thickness and shape of the samples, the influence of the trace element B on solders' reliability can be revealed [11,12]. In the process of aging, external heating atmosphere provide enough energy for mutual diffusion between Sn in solder and Cu in substrate, which makes the thickness and microstructure changed in solder joints.…”

Section: Iumrs International Conference In Asiamentioning

confidence: 99%

Effect of Boron on Microstructure and Properties of Sn-1.0Ag-0.5Cu Low-Silver Lead-Free Solder

Wang¹,

Zhang

Hu³

et al. 2017

MSF

View full text Add to dashboard Cite

In this work, B (boron) was added into Sn-1.0Ag-0.5Cu (SAC105) solder alloy using mechanical alloying method in order to develop a new low-silver lead-free solder, Sn-1.0Ag-0.5Cu-xB, where B ranges from 0wt% to 0.2wt%. The melting characteristics, wettability, mechanical properties of welded joints, and microstructure of this solder were studied. The results showed that with adding B into SAC105 alloy, the melting point and melting range was not obviously changed. Although the wettability decreases with the B content increasing, the solder joints exhibited higher shear strength. As a result, the shear strength was the highest at the B content of 0.2wt%. For example, the shear strength of the Sn-1.0Ag-0.5Cu-0.2B solder was 35.12MPa, while that of the B free SAC105 solder was only 28.94MPa. Furthermore, adding B had a significant effect on grain refinement on the SAC105 solder . Observations on solder matrix and weld joints by SEM showed that the IMC thickness of solder joints with the addition of B was less than the SAC105 lead-free solder. Moreover, with the addition of B, the solder grains were refined obviously which had the effect of refining straitening, and the growing rate of brittle IMC in solder joint could be effectively reduced during soldering and aging process. Thus solder joint performance can be improved significantly.

show abstract

Section: Iumrs International Conference In Asiamentioning

confidence: 99%

Effect of Boron on Microstructure and Properties of Sn-1.0Ag-0.5Cu Low-Silver Lead-Free Solder

Wang¹,

Zhang

Hu³

et al. 2017

MSF

View full text Add to dashboard Cite

show abstract

“…The Sn-Ag-Cu (SAC) family of solder alloys is very popular for using in electronic industries because of its good mechanical properties, wettability and soldering ability. However, this solder alloy has disadvantage of limited ductility due to the brittle phase of Ag 3 Sn and Cu 6 Sn 5 IMCs formed in -Sn matrix [1][2][3][4]. Adding some alloying element such as Ni, In, Sb, Zn, Bi, ZnO and Al 2 O 3 nanoparticles to the solder alloys can improve their properties [2][3][4][5][6].…”

Section: Introductionmentioning

confidence: 99%

Effect of Cooling Rate on the Microstructural and Mechanical Properties of Sn-0.3Ag-0.7Cu-0.05Ni Solder Alloy

Inkong

Sungkhaphaitoon

2017

KEM

View full text Add to dashboard Cite

The effect of cooling rate on the microstructural and mechanical properties of Sn-0.3Ag-0.7Cu-0.05Ni lead-free solder alloy was studied. The microstructure of specimens was characterized by using an optical microscope (OM) and an energy dispersive X-ray spectroscopy (EDX). The mechanical properties were performed by using a universal testing machine (UTM). The results showed that the cooling rate of water-cooled specimens was about 2.37 °C/s and the cooling rate of mold-cooled specimens was about 0.05 °C/s. To compare the different cooling rates, it was found that the grain size of water-cooled specimens was finer than that of the mold-cooled specimens, this resulted in an increment of mechanical properties of solder alloy. A higher tensile strength (33.10 MPa) and a higher elongation (34%) were observed when water-cooled and mold-cooled systems were used, respectively. The microstructure of Sn-0.3Ag-0.7Cu-0.05Ni lead-free solder alloy solidified by both cooling systems exhibited three phases: β-Sn, Ag3Sn and (Cu,Ni)6Sn5 IMCs.

show abstract

“…[4] Then, the third element addition in low-Ag lead-free solder should be considered to inhibit the reduction of joint strength. [5][6][7] Under such background, the aim of this study is to investigate the effect of third element addition on joint properties of Sn-1.0Ag-0.7Cu (mass%). In the particular, the effects of small amount of Bi, Ni and Ge on the joint strength of low-Ag lead-free solder were investigated.…”

Section: Introductionmentioning

confidence: 99%

Effect of third element addition on joint strength of low-Ag lead-free solder

Kobayashi

Shohji

Yamashita

2015

2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC)

View full text Add to dashboard Cite

Effects of additions of small amount of Bi, Ni and Ge in Sn-1.0Ag-0.7Cu (mass%) low-Ag lead-free solder on the strength and microstructure of the solder ball joint were investigated for Cu and electroless Ni-P/immersion Au (ENIG) electrodes.In the case of the Cu electrode, Cu 6 Sn 5 and Cu 3 Sn layers form at the joint interfaces in the joints with Sn-1.0Ag-0.7Cu and Sn-1.0Ag-0.7Cu-2.0Bi (mass%). (Cu,Ni) 6 Sn 5 and (Cu,Ni) 3 Sn layers form at the joint interfaces in the joints with Sn-1.0Ag-0.7Cu-0.07Ni-0.01Ge (masss%) and Sn-1.0Ag-0.7Cu-2.0Bi-0.07Ni-0.01Ge (mass%). In the ball shear test at a low shear speed of 0.001 m/s, fracture mainly occurs in solder and the addition of Bi is effective to improve ball shear force. Similar tendency was observed in the joints with ENIG electrodes. In the ball shear test at a high shear speed of 1 m/s, the addition of Ni is effective to improve ball shear force. After aging at 120 for 3 weeks, ball shear force in the joint with Sn-1.0Ag-0.7Cu-2.0Bi-0.07Ni-0.01Ge was excellent.In the case of the ENIG electrode, Ni-Sn-Cu phases form at the joint interfaces in all solder investigated. In the ball shear test at the high shear speed, the effect of added elements on ball shear force is negligible. Although IMC fracture mainly occurs in the joint with solder including Ni, the effect of IMC fracture on ball shear force is negligible. Furthermore, it was found that absorption energy in the ball shear test decreases when fracture occurs in the IMC layer regardless of the electrode type.

show abstract

Improved strength of boron-doped Sn-1.0Ag-0.5Cu solder joints under aging conditions

Cited by 24 publications

References 35 publications

Effect of Boron on Microstructure and Properties of Sn-1.0Ag-0.5Cu Low-Silver Lead-Free Solder

Effect of Boron on Microstructure and Properties of Sn-1.0Ag-0.5Cu Low-Silver Lead-Free Solder

Effect of Cooling Rate on the Microstructural and Mechanical Properties of Sn-0.3Ag-0.7Cu-0.05Ni Solder Alloy

Effect of third element addition on joint strength of low-Ag lead-free solder

Contact Info

Product

Resources

About