Tensile and low cycle fatigue properties of Sn-5Sb (mass%) solder were investigated with miniature size tensile specimens. The effect of temperature and strain rate on tensile properties and the effect of temperature on low cycle fatigue properties were examined. Tensile strength increases with increasing strain rate regardless of temperature investigated. For elongation, the effect of temperature on it is negligible although it slightly increases with increasing strain rate. The low cycle fatigue life of Sn-5Sb obeys by the Manson-Coffin’s equation. The effect of temperature on the fatigue life is negligible in the temperature range from 25 oC to 150 oC. In the low cycle fatigue test with a high total strain range of 4%, cracking at phase boundary mainly occurs regardless of temperature investigated. In the case of a low total strain range of 0.4%, ductile fracture mainly occurs, and cracking at phase boundary with generation of grooves also occurs at high temperature.

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Tensile and low cycle fatigue properties of Sn-5Sb (mass%) and Sn-10Sb (mass%) were investigated using miniature size specimens, and fracture behaviors of the specimens were observed. Tensile strength and 0.1% proof stress of both alloys decrease with increasing the temperature. The tensile strength and 0.1% proof stress of Sn-10Sb are higher than those of Sn-5Sb at 25°C. Elongation of Sn-5Sb decreases with increasing the temperature except for a strain rate of 2 × 10−1 s−1, while Sn-10Sb increases with increasing temperature. Although elongation of Sn-10Sb is lower than that of Sn-5Sb at 25°C, the difference between them is small at 150°C. Chisel-point fracture was observed in both alloys regardless of conditions of the tensile test. The low cycle fatigue lives of Sn-5Sb and Sn-10Sb alloys obey the Manson–Coffin equation, and the fatigue ductility exponent, α, was 0.54 for Sn-5Sb and 0.46 for Sn-10Sb in the temperature range from 25°C to 150°C. On the basis of the observation of fractured specimens and the investigation of α, it was clarified that the crack progress can be delayed by the formation of coarse SbSn compounds in the Sn-Sb alloy, and thus the fatigue properties can be improved.

Tensile properties of Sn-5Sb (mass%) and Sn-3.5Ag-0.5Cu-0.07Ni-0.01Ge (mass%) were investigated using miniature size specimens and obtained results were compared. Tensile strength of both alloys increase with increasing the strain rate and decrease with increasing the temperature. Although similar dependency to the temperature is observed in 0.1% proof stress, the effect of the strain rate on it is obscure. The tensile strength and the 0.1% proof stress of Sn-3.5Ag-0.5Cu-0.07Ni-0.01Ge are higher than those of Sn-5Sb. The elongation of Sn-5Sb is relatively stable at the range from 0.4 to 0.6. The elongation of Sn-3.5Ag-0.5Cu-0.07Ni-0.01Ge which is approximately 0.3, is inferior to that of Sn-5Sb. On the basis of investigation of stress exponent, n, it was clarified that dispersion strengthening by Ag3Sn particulates in Sn-3.5Ag-0.5Cu-0.07Ni-0.01Ge is effective to prevent the degradation of creep resistance compared with Sn-5Sb that is strengthened by solid-solution of Sb in β-Sn phases and dispersion of SbSn compounds.

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