Fracture Behaviors of Miniature Size Specimens of Sn-5Sb Lead-Free Solder under Tensile and Fatigue Conditions

Kobayashi, Kyosuke; Shohji, Ikuo; Koyama, Satoshi; Hokazono, Hiroaki

doi:10.1016/j.proeng.2017.04.091

Cited by 9 publications

(6 citation statements)

References 11 publications

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“…Figure 4(a) shows the SEM morphology of the Sn5Sb–0.5Cu–0.1Ni–0.5Ag/Cu. According to the elemental mapping of Figure 4(a), the IMCs were distributed uniformly in the bulk solder, especially the Ag 3 Sn in a fine particle form (Kobayashi et al , 2017). Figure 5 shows the microstructure and element mappings of the bulk solder of Sn–5Sb/Cu.…”

Section: Resultsmentioning

confidence: 99%

“…At present, the replacement of lead-containing solders by lead-free high-temperature solders is an inevitable trend for electronic packaging. The temporary exemptions provided by the RoHS Directive for certain special high-lead solders (more than 85% lead) used in specific high-temperature applications have not been regulated yet (Kobayashi et al , 2017; Gan et al , 2009). However, recently, many investigators have devoted work to using lead-free solders, for example, Sn–9Zn (Kotadia et al , 2014), Sn–0.7Cu (Kotadia et al , 2014), Sn–3.5Ag (Kotadia et al , 2014), Sn–3.0Ag–0.5Cu (Gain and Zhang, 2016a, 2016b), Sn–14Bi–5In (Gnecco et al , 2007), In–48Sn (Li et al , 2007), Sn–35Bi–1Ag (Gain and Zhang, 2017) and Sn–58Bi (Li et al , 2006) as replacements for the toxic Sn–Pb alloy in electronic packaging systems.…”

Section: Introductionmentioning

confidence: 99%

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Effect of Cu, Ni, Ag addition on creeping properties of Sn5Sb-0.5Cu-0.1Ni-0.5Ag for high temperature packaging

Han

Sun

Zhang

et al. 2022

SSMT

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Purpose This paper aims to investigate the effect of the Cu, Ni and Ag addition in Sn5Sb-based alloy on the mechanical properties and its mechanism. Design/methodology/approach The micro-indentation, creeping test of the Cu/Sn5Sb–0.5Cu–0.1Ni–0.5Ag/Cu and Cu/Sn–5Sb/Cu were conducted, and its microstructure was analysed. The scanning electron microscope and the metallographic microscope characterized the microstructure of the Sn5Sb–0.5Cu–0.1Ni–0.5Ag/Cu and Sn–5Sb/Cu joints. Findings The microstructure of Cu/Sn5Sb–0.5Cu–0.1Ni–0.5Ag/Cu is distributed with the fine (Cu,Ni)6Sn5 and Ag3Sn intermetallic compounds (IMCs), whereas the Cu6Sn5 and Sn3Sb2 in Cu/Sn–5Sb/Cu is larger and far more less. This investigation reveals that the addition of the Cu, Ni and Ag elements reinforced mechanical properties and provided a technical basis for the development of Sn–Sb alloy with good mechanical properties. Originality/value This paper reveals that the hardness and the modulus of the bulk solder Cu/Sn–5Sb/Cu solder joints were improved with the addition of Cu, Ni and Ag trace elements. Meanwhile, the creep resistance and plasticity were also improved. This study has a great value for exploring high-performance Sn–Sb based solder alloy and has proved an example.

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Section: Resultsmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Effect of Cu, Ni, Ag addition on creeping properties of Sn5Sb-0.5Cu-0.1Ni-0.5Ag for high temperature packaging

Han

Sun

Zhang

et al. 2022

SSMT

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“…Sn-Sb alloys are one of the potential candidates for interconnect materials to meet the challenging hightemperature resistance and strength requirements of third-generation semiconductor packaging, replacing traditional high-Pb alloys, thereby facilitating the development of electronic packaging materials and technologies [14][15][16][17][18]. The several quality investigations [14,18] have given physical and mechanical properties of Sn-Sb alloys, which reveals that Sn-5Sb (wt%) near peritectic alloy has favorable wettability, excellent electrical conductivity, and relatively high strength. Actually, Sn-Sb alloys have also recently obtained much attention on the application of lithium/potassium ion batteries (LIBs and PIBs) due to high-capacity anode and enhanced the cycling life of LIBs and PIBs [19][20][21][22].…”

Section: Introductionmentioning

confidence: 99%

Microstructure evolution, IMC growth, and microhardness of Cu, Ni, Ag-microalloyed Sn–5Sb/Cu solder joints under isothermal aging

Xin

Wang

Sun

2022

J Mater Sci: Mater Electron

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In this work, various Cu, Ni, Ag-microalloyed Sn–5Sb/Cu joints, ordinary Sn–5Sb/Cu joints, and low-melting-point Sn–3Ag–0.5Cu (SAC305)/Cu (used for comparison) were prepared, focusing on the influence of Cu, Ni, and Ag on the microstructure evolution, interfacial IMC growth, and microhardness of Sn–5Sb/Cu joint under long-time isothermal aging process. Results showed that the microstructure of microalloyed joints consisted of β-Sn matrix, SbSn, and (Cu, Ni) 6 Sn 5 and Ag 3 Sn compounds. (Cu, Ni) 6 Sn 5 compounds generated a coarsening effect in the aging microalloyed joints, yet its coarsening speed is significantly lower than the ordinary Sn–5Sb/Cu. Meanwhile, the total IMC layer thickness increased with the rising aging time. A single fine dendritic (Cu, Ni) 6 Sn 5 IMC at the interface of microalloyed joint was observed and evolved into a larger scallop or layer-like duplex IMCs ((Cu, Ni) 6 Sn 5 + Cu 3 Sn) after the aging. Considering the combined effect of Cu, Ni, and Ag, the microalloyed joints exhibited the improved microstructure relative to ordinary counterparts and low-melting-point SAC305 materials, significantly inhibiting the interfacial IMC growth, especially Cu 3 Sn. The Cu 3 Sn IMC thickness and diffusion coefficient in the Sn–5Sb–0.5Cu–0.1Ni–0.5Ag/Cu joint were 0.71–2.81 μm and 0.96 × 10 –6 μm·s −2 , respectively. Besides, the precipitation strengthening mechanism triggered by the microalloyed elements was extremely obvious and the soldering and aging joints revealed superior microhardness values of 20–35 HV. This could effectively improve the application range of Sn–5Sb-based materials in higher-temperature package conditions such as third-generation semiconductors.

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“…Sn-Sb alloys are one of the candidates for the substitution of the Pb-rich solders [9][10][11]. It has been reported that Sn-5Sb (mass%) has excellent thermal fatigue behaviors and relatively high fracture strength [12,13]. In addition, in Sn-Sb alloys with high concentration of Sb, mechanical strength is improved by solid-solution of Sb in β-Sn matrix and dispersion of SbSn compounds [14].…”

Section: Introductionmentioning

confidence: 99%

Comparison of Sn‐5Sb and Sn‐10Sb Alloys in Tensile and Fatigue Properties Using Miniature Size Specimens

Kobayashi

Mitsui

et al. 2018

Advances in Materials Science and Engineering

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Tensile and low cycle fatigue properties of Sn-5Sb (mass%) and Sn-10Sb (mass%) were investigated using miniature size specimens, and fracture behaviors of the specimens were observed. Tensile strength and 0.1% proof stress of both alloys decrease with increasing the temperature. The tensile strength and 0.1% proof stress of Sn-10Sb are higher than those of Sn-5Sb at 25°C. Elongation of Sn-5Sb decreases with increasing the temperature except for a strain rate of 2 × 10−1 s−1, while Sn-10Sb increases with increasing temperature. Although elongation of Sn-10Sb is lower than that of Sn-5Sb at 25°C, the difference between them is small at 150°C. Chisel-point fracture was observed in both alloys regardless of conditions of the tensile test. The low cycle fatigue lives of Sn-5Sb and Sn-10Sb alloys obey the Manson–Coffin equation, and the fatigue ductility exponent, α, was 0.54 for Sn-5Sb and 0.46 for Sn-10Sb in the temperature range from 25°C to 150°C. On the basis of the observation of fractured specimens and the investigation of α, it was clarified that the crack progress can be delayed by the formation of coarse SbSn compounds in the Sn-Sb alloy, and thus the fatigue properties can be improved.

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Fracture Behaviors of Miniature Size Specimens of Sn-5Sb Lead-Free Solder under Tensile and Fatigue Conditions

Cited by 9 publications

References 11 publications

Effect of Cu, Ni, Ag addition on creeping properties of Sn5Sb-0.5Cu-0.1Ni-0.5Ag for high temperature packaging

Effect of Cu, Ni, Ag addition on creeping properties of Sn5Sb-0.5Cu-0.1Ni-0.5Ag for high temperature packaging

Microstructure evolution, IMC growth, and microhardness of Cu, Ni, Ag-microalloyed Sn–5Sb/Cu solder joints under isothermal aging

Comparison of Sn‐5Sb and Sn‐10Sb Alloys in Tensile and Fatigue Properties Using Miniature Size Specimens

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