Abstract:Effects of additions of small amount of Bi, Ni and Ge in Sn-1.0Ag-0.7Cu (mass%) low-Ag lead-free solder on the strength and microstructure of the solder ball joint were investigated for Cu and electroless Ni-P/immersion Au (ENIG) electrodes.In the case of the Cu electrode, Cu 6 Sn 5 and Cu 3 Sn layers form at the joint interfaces in the joints with Sn-1.0Ag-0.7Cu and Sn-1.0Ag-0.7Cu-2.0Bi (mass%). (Cu,Ni) 6 Sn 5 and (Cu,Ni) 3 Sn layers form at the joint interfaces in the joints with Sn-1.0Ag-0.7Cu-0.07Ni-0.01Ge… Show more
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