2005
DOI: 10.1109/led.2005.844694
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Improved reliability of AlGaN-GaN HEMTs using an NH/sub 3/ plasma treatment prior to SiN passivation

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Cited by 120 publications
(63 citation statements)
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“…In spite of temporary stabilization of surface properties, an additional surface layer causes stress-induced changes in the barrier layer [11][12][13][14] and changes the conditions for the formation of 2DEG as a result of piezoelectric and spontaneous polarization effects. Therefore, additional methods, such as plasma pretreatment, 15,16 were used before passivation to improve the electrical properties of 2DEG. The authors of Ref.…”
Section: Introductionmentioning
confidence: 99%
“…In spite of temporary stabilization of surface properties, an additional surface layer causes stress-induced changes in the barrier layer [11][12][13][14] and changes the conditions for the formation of 2DEG as a result of piezoelectric and spontaneous polarization effects. Therefore, additional methods, such as plasma pretreatment, 15,16 were used before passivation to improve the electrical properties of 2DEG. The authors of Ref.…”
Section: Introductionmentioning
confidence: 99%
“…Three samples (A, B, and C) with different SiN x compositions (N=Si) were fabricated on p-type Si substrates. The SiN x films were formed by chemical vapor deposition (CVD) with SiH 2 Cl 2 and NH 3 . The N=Si values were controlled by NH 3 gas supply.…”
Section: Methodsmentioning
confidence: 99%
“…5 SiN passivation A significant impact of the pretreatment on the transistor degradation has been observed [7] such that a NH 3 plasma pretreatment resulted in a significant improvement in device stability, thus highlighting that the surface conditions of GaN is an important parameter for a good passivation. Here we investigate the impact of the passivation material itself but keep the pretreatment unchanged.…”
Section: Epitaxial Growth and Processingmentioning
confidence: 99%