2001
DOI: 10.1007/bf02665842
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Improved morphology and crystalline quality of MBE CdZnTe/Si

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Cited by 31 publications
(24 citation statements)
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“…2,3 Si(211) wafer surfaces are initially hydrogen passivated ex situ, using an HF-based solution. Upon loading the Si substrate into the MBE chamber (VG80H, Oxford Instruments), hydrogen is desorbed while ramping to approximately 700°C and exposing the surface to an As 4 flux.…”
Section: Methodsmentioning
confidence: 99%
“…2,3 Si(211) wafer surfaces are initially hydrogen passivated ex situ, using an HF-based solution. Upon loading the Si substrate into the MBE chamber (VG80H, Oxford Instruments), hydrogen is desorbed while ramping to approximately 700°C and exposing the surface to an As 4 flux.…”
Section: Methodsmentioning
confidence: 99%
“…The buffer layers of zinc telluride and cadmium telluride were deposited as previously reported. 1 The thermocouple temperature for the deposition was 140°C; we believe this to correspond to a real temperature of 290°C because we can reproduce the results of Almeida et al with this thermocouple reading. Five times during each deposition, the CdTe flux was interrupted, a Te flux of 1-2 ϫ 10 Ϫ6 Torr was initiated, and the substrate was heated to 535°C 12 for 15 min to anneal the epilayer.…”
Section: Methodsmentioning
confidence: 72%
“…The most common scheme uses a CdTe buffer layer between the silicon wafer and the MCT epilayers. 1 A 19% lattice mismatch between Si and MCT must be accommodated. Strain relaxation occurs by the formation of misfit dislocations at the interface.…”
Section: Introductionmentioning
confidence: 99%
“…The semiconductor properties of this material are suitable for application in solar cells and many other optoelectronic devices such as detectors for the infrared and x-ray. [1][2][3][4] The most used techniques used to obtain these films are organo-metalic chemical vapour deposition [5], closed spaced sublimation [6], physical vapour deposition [7], molecular beam epitaxy [8], electrodeposition [9] and sputtering [10]. All these techniques have advantages and disadvantages depending on the type of application intended for the film.…”
Section: Introductionmentioning
confidence: 99%
“…The most used techniques to obtain these films are organometalic chemical vapour deposition [5], closed spaced sublimation [6], physical vapour deposition [7], molecular beam epitaxy [8], electrodeposition [9] and sputtering [10]. All these techniques have advantages and disadvantages depending on the type of application intended for the film.…”
mentioning
confidence: 99%