2022
DOI: 10.1016/j.solmat.2022.111647
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Impact of rapid thermal processing on bulk and surface recombination mechanisms in FZ silicon with fired passivating contacts

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Cited by 4 publications
(3 citation statements)
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“…This could indicate that the homogeneity of the thin SiO x layer at the interface starts being compromised. In a recent study, we observed the degradation of the surface passivation of similar samples with the increase in firing dwell-time, with a more pronounced degradation for dwell-times superior to 30 s . This is in good agreement with the present XRR investigations and confirms that the vanishing of the fringes is linked to the breakup of the thin SiO x along the interface.…”
Section: Discussionsupporting
confidence: 92%
See 1 more Smart Citation
“…This could indicate that the homogeneity of the thin SiO x layer at the interface starts being compromised. In a recent study, we observed the degradation of the surface passivation of similar samples with the increase in firing dwell-time, with a more pronounced degradation for dwell-times superior to 30 s . This is in good agreement with the present XRR investigations and confirms that the vanishing of the fringes is linked to the breakup of the thin SiO x along the interface.…”
Section: Discussionsupporting
confidence: 92%
“… 32 We note that for this type of symmetrical samples made from shiny-etched FZ c-Si wafers, we observed the formation of shallow electronic defect states in the bulk c-Si limiting the effective lifetime at first order under certain conditions (and thus leading to underestimation of the surface passivation properties provided by our poly-Si contact). For further details on this matter, the interested reader is referred to ref ( 42 ).…”
Section: Discussionmentioning
confidence: 99%
“…A layer of in-situ p-type SiCx and an interfacial oxide formed in hot HNO3 were used as the passivating contacts as illustrated by the F-J Haug et al [11] investigation into the quick thermal processing of p-type silicon. Starting at 450 o C, the firing process generates a sizable number of shallow mass defects in the beneath FZ silicon, which transition into the defect curing phase for firing temperature of 800 o C and higher.…”
Section: Literature Surveymentioning
confidence: 99%