• Blister-free boron-doped poly-Si layers are obtained by PECVD through optimization of the deposition temperature and gas ratio. • The process developed is approaching the industrial standards (large area KOH-polished wafers, SiOx growth included in standard RCA cleaning, semi-industrial PECVD tool). • High and homogeneous surface passivation properties are obtained (iVoc = 734 mV and J0 = 7 fA•cm-2). • Conductive spots detected by C-AFM are not mirroring pinholes within the interfacial SiOx layer.