1999
DOI: 10.1016/s0921-4526(99)00459-7
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Hydrogenation and passivation of electron-beam-induced defects in N-type Si

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Cited by 6 publications
(3 citation statements)
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“…temperature during irradiation. To increase hydrogen concentration, the sample is first annealed in boiling water for 24 h [49], and then annealed in air from 300 • C to 450 • C in steps of 30 min on a hotplate [25]. To reduce laser scatter at the silicon interface, a coarse polish is applied to the larger faces of the sample, followed by a brief etch in a 1:10 HF/HNO 3 solution to remove surface strain.…”
Section: Discussionmentioning
confidence: 99%
“…temperature during irradiation. To increase hydrogen concentration, the sample is first annealed in boiling water for 24 h [49], and then annealed in air from 300 • C to 450 • C in steps of 30 min on a hotplate [25]. To reduce laser scatter at the silicon interface, a coarse polish is applied to the larger faces of the sample, followed by a brief etch in a 1:10 HF/HNO 3 solution to remove surface strain.…”
Section: Discussionmentioning
confidence: 99%
“…Hydrogenation and passivation of electron-beam-induced defects in n-Si has been recently studied by Ohmura et al [10] where hydrogenation has reduced the concentrations of the E 1 level (A centre: O-V complex), E 2 level (double-negative charge state of the di-vacancy) and E 3 level (single-negative charge state of di-vacancy). A new level at 0.33 eV below the conduction band edge has been shown to emerge after the hydrogenation, which has been related to the radiation-induced defect hydrogen complex.…”
Section: L45mentioning
confidence: 99%
“…An irradiation dose of 320 kGy was applied to the crystal using 10 MeV electrons, with intermittent application of cooling dry ice to maintain a relatively low sample temperature during irradiation. To increase hydrogen concentration, the sample was first annealed in boiling water for 24 hours [38], and then annealed in air from 300 • C to 450 • C in steps of 30 minutes on a hotplate [3]. To reduce laser scatter at the silicon interface, a coarse polish…”
Section: Appendix A: Sample Preparationmentioning
confidence: 99%