1996
DOI: 10.1016/0927-0248(95)00098-4
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Hydrogen in silicon: A discussion of diffusion and passivation mechanisms

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Cited by 158 publications
(106 citation statements)
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“…3,39 In our experiments, we have directly observed the presence of vacancy-H complexes in our samples by IR spectroscopy. Figure 6 shows a vibrational line at 2223 cm −1 that is due to the vacancy-H 4 complex in Si ͑Refs.…”
Section: Vacancy-hydrogen Complexesmentioning
confidence: 99%
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“…3,39 In our experiments, we have directly observed the presence of vacancy-H complexes in our samples by IR spectroscopy. Figure 6 shows a vibrational line at 2223 cm −1 that is due to the vacancy-H 4 complex in Si ͑Refs.…”
Section: Vacancy-hydrogen Complexesmentioning
confidence: 99%
“…It has been proposed that the Si vacancy might play a role during hydrogenation processes. 3,39 Vacancy-H complexes have been studied previously by IR spectroscopy, 40,41 which has made it possible for us to detect the presence of vacancies that have been introduced into Si samples during hydrogenation treatments.…”
Section: Introductionmentioning
confidence: 99%
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“…[20][21][22][23][24][25][26][27] The physical mechanisms of bulk passivation by hydrogenation are not yet completely understood. For instance, the hydrogen diffusion mechanism 28 and the role of an aluminum back surface field (Al-BSF) in this process [29][30][31][32][33][34] as well as the interaction between hydrogen and oxygen complexes in silicon 35,36 are still the subject of discussion. The benefits of bulk passivation by silicon nitride however are so evident that its implementation in the production process of mc-Si solar cells has become a priority for the PV industry.…”
Section: Introductionmentioning
confidence: 99%
“…It is considered unlikely that this represents an increase in the flux of hydrogen incident on the sample. The most plausible explanations are that this difference is due to either etching of the silicon or the creation of signicant quantities of defects near the silicon surface through the plasma exposure [14,15]. The defects can effectively trap hydrogen, and thus reduce the amount of hydrogen available to deactivate boron or diffuse further into the wafer, while hydrogen located at the defects cannot be detected using the eCV method.…”
Section: Resultsmentioning
confidence: 99%