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The high cost of wafers suitable for epitaxial deposition of III-V solar cells has been a primary barrier to widespread use of these cells in low-concentration and one-sun terrestrial solar applications. A possible solution is to reuse the substrate many times, thus spreading its cost across many cells. We performed a bottom-up techno-economic analysis of three different strategies for substrate reuse in high-volume manufacturing: epitaxial lift-off, spalling, and the use of a porous germanium release layer. The analysis shows that the potential cost reduction resulting from substrate reuse is limited in all three strategies--not by the number of reuse cycles achievable, but by the costs that are incurred in each cycle to prepare the substrate for another epitaxial deposition. The dominant substrate-preparation cost component is different for each of the three strategies, and the cost-ranking of these strategies is subject to change if future developments substantially reduce the cost of epitaxial deposition.

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This paper describes a model to predict mechanical strength distribution of silicon wafers. A generalized expression, based on a multimodal Weibull distribution, is proposed to describe the strength of a brittle material with surface, edge, and bulk flaws. The specific case of a cast, unpolished photovoltaic (PV) wafer is further analyzed. Assuming that surface microcracks constitute the dominant mechanism of wafer breakage, this model predicts the strength distribution of PV silicon that matches well the experimental results available in the literature.