Highly thermally conductive polybenzoxazine composites based on boron nitride flakes deposited with copper particles

Wang, Yi; Wu, Wei; Drummer, Dietmar; Liu, Chao; Shen, Wanting; Tomiak, Florian; Schneider, Kevin; Liu, Xingrong; Chen, Qiming

doi:10.1016/j.matdes.2020.108698

Cited by 49 publications

(26 citation statements)

References 57 publications

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“…Compared with pure EP, the TC of EG/EP composite (Figure 8(c1)) is obviously improved due to the fact that thermally conductive network is constructed by porous EG with low‐filler loading and effectively degassing through the pre‐dispersion and vacuum assisted mixing strategy (Figure 8(a)). The formation of the thermally conductive network is beneficial for the effective transmission of phonons and electrons 1,5,55 . However, it is lack of interface interaction between EG and EP in EG/EP composite (Figure 8(c2)).…”

Section: Resultsmentioning

confidence: 99%

“…The formation of the thermally conductive network is beneficial for the effective transmission of phonons and electrons. 1,5,55 However, it is lack of interface interaction between EG and EP in EG/EP composite (Figure 8(c2)). After introducing PPD to boost the interfacial compatibility of EG and EP, the TC of EG composite is further enhanced (Figure 8(d1),(d2)).…”

Section: Mechanism Of Thermal Conductionmentioning

confidence: 99%

“…Polymer‐based composites, combining the advantages of polymer (ease of processing, lightweight, and stability, etc.) with fillers (high‐thermal conductivity [TC]), are widely used in the field of thermal management 5–7 . Unfortunately, a high‐filler content (>50 wt%) 8 is required to reach targeted TC (>1 W·m −1 ·K −1 ) 9 for most composites owing to the high‐interface thermal resistance (ITR) and low TC improvement efficiency, which inevitably cause high cost, high density, preparation difficulties, and other problems 10 .…”

Section: Introductionmentioning

confidence: 99%

“…with fillers (high-thermal conductivity [TC]), are widely used in the field of thermal management. [5][6][7] Unfortunately, a high-filler content (>50 wt%) 8 is required to reach targeted TC (>1 WÁm À1 ÁK À1 ) 9 for most composites owing to the highinterface thermal resistance (ITR) and low TC improvement efficiency, which inevitably cause high cost, high density, preparation difficulties, and other problems. 10 Therefore, the research of polymer-based composites with high TC at low-filler loading is crucial but also remains a challenge.…”

Section: Introductionmentioning

confidence: 99%

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High‐thermal conductivities of epoxy composites via p‐phenylenediamine interfacial modification and process intensification

Bao

Cui

et al. 2021

J of Applied Polymer Sci

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High loadings of fillers are usually needed to achieve high‐thermal conductivity (TC) of polymer‐based composites, which inevitably sacrifices processability and meanwhile causes high‐cost. Therefore, it is of great significance to achieve high‐TC composites under low‐filler loading. Here, a novel p‐phenylenediamine (PPD) modified expanded graphite (EG‐PPD)/epoxy (EP) composite with high TC and low‐filler content was successfully prepared via pre‐dispersion and vacuum assisted mixing strategy. With the improved interfacial compatibility between EG and EP by PPD, the prepared EG‐PPD/EP composite exhibited excellent thermal management performance, resulting in the TC of which reached 4.00 W·m−1·K−1 with only 10 wt% (5.59 vol%) of EG‐PPD, which is approximately 19 times higher than that of pure EP. Meantime, the interface thermal resistance of EG‐PPD/EP composite between EG‐PPD and EP is reduced by 33% compared with EG/EP composite. This composite with excellent TC property is expected to be used in thermal management field.

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Section: Resultsmentioning

confidence: 99%

Section: Mechanism Of Thermal Conductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

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High‐thermal conductivities of epoxy composites via p‐phenylenediamine interfacial modification and process intensification

Bao

Cui

et al. 2021

J of Applied Polymer Sci

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“…To fully determine the relationship between the content of CNTs in BN@xCNT hybrid fillers and their effect on thermal conductivity of corresponding PBz composites, filler loading over and below the percolation threshold were both investigated, since the pattern of thermal conductivity differs. According to former research, the percolation threshold in a similar system was about 20 wt% [ 35 ]. Therefore, 15 wt% and 25 wt% were chosen as the filler loading in this part.…”

Section: Resultsmentioning

confidence: 99%

Achieving a 3D Thermally Conductive while Electrically Insulating Network in Polybenzoxazine with a Novel Hybrid Filler Composed of Boron Nitride and Carbon Nanotubes

Wang

Drummer

et al. 2020

Polymers

Self Cite

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To solve the problem of excessive heat accumulation in the electronic packaging field, a novel series of hybrid filler (BN@CNT) with a hierarchical “line-plane” structure was assembled via a condensation reaction between functional boron nitride(f-BN) and acid treated carbon nanotubes (a-CNTs). The reactions with different mass ratios of BN and CNTs and the effect of the obtained hybrid filler on the composites’ thermal conductivity were studied. According to the results, BN@15CNT exhibited better effects on promoting thermal conductivity of polybenzoxazine(PBz) composites which were prepared via ball milling and hot compression. The thermally conductive coefficient value of PBz composites, which were loaded with 25 wt% of BN@15CNT hybrid fillers, reached 0.794 W· m−1· K−1. The coefficient value was improved to 0.865 W· m−1· K−1 with 15 wt% of BN@15CNT and 10 wt% of BN. Although CNTs were adopted, the PBz composites maintained insulation. Dielectric properties and thermal stability of the composites were also studied. In addition, different thermal conduction models were used to manifest the mechanism of BN@CNT hybrid fillers in enhancing thermal conductivity of PBz composites.

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A Roadmap Review of Thermally Conductive Polymer Composites: Critical Factors, Progress, and Prospects

Wang

Weng

et al. 2023

Adv Funct Materials

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Recently, the need for miniaturization and high integration have steered a strong technical wave in developing (micro‐)electronic devices. However, excessive amounts of heat may be generated during operation/charging, severely affecting device performance and leading to life/property loss. Benefiting from their low density, easy processing and low manufacturing cost, thermally conductive polymer composites have become a research hotspot to mitigate the disadvantage of excessive heat, with potential applications in 5G communication, electronic packaging and energy transmission. By far, the reported thermal conductivity coefficient (λ) of thermally conductive polymer composite is far from expectation. Deeper understanding of heat transfer mechanism is desired for developing next generation thermally conductive composites. This review holistically scopes current advances in this field, while giving special attention to critical factors that affect thermal conductivity in polymer composites as well as the thermal conduction mechanisms on how to enhance the λ value. This review covers critical factors such as interfacial thermal resistance, chain structure of polymer, intrinsic λ value of different thermally conductive fillers, orientation/configuration of nanoparticles, 3D interconnected networks, processing technology, etc. The applications of thermally conductive polymer composites in electronic devices are summarized. The existing problems are also discussed, new challenges and opportunities are prospected.

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Highly thermally conductive polybenzoxazine composites based on boron nitride flakes deposited with copper particles

Cited by 49 publications

References 57 publications

High‐thermal conductivities of epoxy composites via p‐phenylenediamine interfacial modification and process intensification

High‐thermal conductivities of epoxy composites via p‐phenylenediamine interfacial modification and process intensification

Achieving a 3D Thermally Conductive while Electrically Insulating Network in Polybenzoxazine with a Novel Hybrid Filler Composed of Boron Nitride and Carbon Nanotubes

A Roadmap Review of Thermally Conductive Polymer Composites: Critical Factors, Progress, and Prospects

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