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With unique physicochemical properties, multiwalled carbon nanotubes (MWCNTs) have enabled major achievement in polymer composites as reinforcing fillers. Nevertheless, high conductivity of raw MWCNTs (R‐MWCNTs) limits their wider applications in certain fields, which require outstanding thermal conductivity, mechanical, and insulation properties simultaneously. In this article, silica (SiO2) coated MWCNTs core–shell hybrids (SiO2@MWCNTs) and organically modified montmorillonite (O‐MMT) are employed to modify epoxy (EP) simultaneously. The epoxy‐clay system is cured by using anhydride curing agent. The impact strength and flexural strength of final nanocomposites are greatly improved. Meanwhile, the final composites remain in high electrical insulation. Compared to mixed acid treated MWCNTs (C‐MWCNTs) (0.5 wt%)/EP nanocomposites, the volume resistivity of the O‐MMT(4 wt%)/SiO2@MWCNTs(0.5 wt%)/EP nanocomposites increases more than six orders of magnitude. Synergistic toughening effect occurs when using core–shell SiO2@MWCNTs and MMT bifillers. The electrical insulation is attributed to the suppressed electron transport effect by SiO2 layer on the CNTs surface, and the blocked conductive CNTs network by the buried 2D structural O‐MMT. The SiO2@MWCNTs core–shell hybrids also benefit to decrease the dielectric constant and dielectric loss of CNTs/EP composites. This work provides guidance to using CNTs as reinforcement fillers to toughen the polymers for electric insulating applications.

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Medical staffs lack the basic knowledge and harbor misconceptions about the clinical use of morphine for cancer pain treatment. Creating training opportunities for medical staffs is necessary to increase their awareness and knowledge of effective cancer pain management.

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Recently, the need for miniaturization and high integration have steered a strong technical wave in developing (micro‐)electronic devices. However, excessive amounts of heat may be generated during operation/charging, severely affecting device performance and leading to life/property loss. Benefiting from their low density, easy processing and low manufacturing cost, thermally conductive polymer composites have become a research hotspot to mitigate the disadvantage of excessive heat, with potential applications in 5G communication, electronic packaging and energy transmission. By far, the reported thermal conductivity coefficient (λ) of thermally conductive polymer composite is far from expectation. Deeper understanding of heat transfer mechanism is desired for developing next generation thermally conductive composites. This review holistically scopes current advances in this field, while giving special attention to critical factors that affect thermal conductivity in polymer composites as well as the thermal conduction mechanisms on how to enhance the λ value. This review covers critical factors such as interfacial thermal resistance, chain structure of polymer, intrinsic λ value of different thermally conductive fillers, orientation/configuration of nanoparticles, 3D interconnected networks, processing technology, etc. The applications of thermally conductive polymer composites in electronic devices are summarized. The existing problems are also discussed, new challenges and opportunities are prospected.

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